Method to reduce corner shunting during fabrication of CPP read heads

1. A method for fabricating a CPP read head having a CPP read head sensor and a hard bias layer, said method comprising:

A) depositing a strip of sensor material in a sensor material region;

B) depositing strips of fast-milling dielectric material in first and second fast-milling dielectric material regions adjacent to said sensor material region;

C) depositing a protective layer on said sensor material region and said first and second fast-milling material regions;

D) depositing a layer of masking material on said strip of sensor material and said strips of fast-milling dielectric material to provide masked areas and exposed areas of said sensor material region and said first and second fast-milling dielectric material regions;

E) providing a shaping source which shapes said exposed areas;

F) depositing said hard bias material on said region of sensor material and said first and second regions of fast-milling dielectric material to form a cap of hard bias material on each of these regions;

G) removing said cap of hard bias material and said masking material from each of these regions.

2. The method of claim 1 , wherein:

said fast-milling dielectric of B is chosen from a group consisting of Ta 2 O 5 , SiO 2 , Si 3 N 4 , AlN, variable compositions of Al—Si—O—N, HfO 2 , ZrO 2 , and Hf 1-x Si x O 2 .

3. The method of claim 1 , wherein:

after E, said exposed areas of said fast-milling dielectric produce a residual step height of less than 100 Å.

4. The method of claim 1 , wherein:

after E, said exposed areas of said fast-milling dielectric produce a residual step height which is negative.

5. The method of claim 1 , wherein:

said masking material of D is photoresist.

6. The method of claim 1 , wherein:

said shaping source of E is ion-beam, etch tools.

7. The method of claim 1 , wherein:

said sensor material is a plurality of layers of material, which includes a tunnel barrier layer.

8. A method for fabricating a CPP read head for a hard disk drive having a CPP read head sensor and a hard bias layer, said method comprising:

A) forming a sensor layer stack in a sensor material region;

B) forming fast-milling dielectric stacks in first and second fast-milling dielectric material regions adjacent to said sensor material region;

C) depositing a layer of masking material on said sensor layer stack and said fast-milling dielectric stacks;

D) shaping said sensor layer stack to desired track width and shaping said fast-milling dielectric stacks to have a reduced residual step height;

E) depositing said hard bias material on said region of sensor material and said first and second regions of fast-milling dielectric material to form and a cap of hard bias material on each of these regions;

F) removing said cap of hard bias material from each of these regions.

9. The method of claim 8 , wherein:

said fast-milling dielectric of B is chosen from a group consisting of Ta 2 O 5 , SiO 2 , Si 3 N 4 , AlN, variable compositions of Al—Si—O—N, HfO 2 , ZrO 2 , and Hf 1-x Si x O 2 .

10. The method of claim 8 , wherein:

after D, said exposed areas of said fast-milling dielectric produce a residual step height of less than 100 Å.

11. The method of claim 8 , wherein:

after D, said exposed areas of said fast-milling dielectric produce a residual step height which is negative.

12. The method of claim 8 , wherein:

said masking material of D is photoresist.

13. The method of claim 8 , wherein:

said shaping source of E is ion-beam, etch tools.

14. The method of claim 8 , wherein:

said sensor material is a plurality of layers of material including a tunnel barrier layer.

15. A magnetic head having a CPP read head for a hard disk drive, comprising:

a sensor stack that has been shaped into a CPP sensor;

stacks of fast-milling dielectric material adjacent to said sensor stack, said stacks of fast-milling dielectric material being shaped along with said sensor stack so that a residual step of step height of 100 Åor less remains in first and second fast-milling dielectric material regions adjacent to said sensor material region; and,

a hard bias layer which has been deposited over said sensor stack and fast-milling dielectric stacks, such that separate caps are formed due to the reduced residual step height, and said caps are removed by CMP processes.

16. The magnetic head of claim 15 , wherein:

said residual step height is negative.