Organic light-emitting display device having a frit seal and method for fabricating the same

1. An organic light-emitting device comprising:

a first substrate;

a second substrate;

an array of light-emitting pixels interposed between the first and the second substrate;

a frit layer formed between the second substrate and the array, wherein the frit layer is substantially non-transparent to visible light; and

a frit seal interconnecting the first substrate and the frit layer while surrounding the array on every side of the array such that the frit layer, the frit seal and the first substrate form an enclosed space where the array is located, wherein the frit seal is integral with and comprises the same composition as the frit layer and provides an exterior surface of the device.

2. The device of claim 1 , wherein the frit layer is formed on the second substrate, and wherein the second substrate comprises a single layer or multiple layers.

3. The device of claim 1 , wherein the frit layer is not adhered to the array of light emitting pixels.

4. The device of claim 1 , wherein the first substrate and the second substrate are transparent.

5. A method of making the organic light-emitting device of claim 1 , the method comprising:

providing an unfinished device comprising the first substrate and the array of organic light emitting pixels;

providing the second substrate, the frit layer and a peripheral frit, wherein the frit layer is formed over a surface of the second substrate, wherein the peripheral frit surrounds the frit layer and is connected to the frit layer;

placing the second substrate over the unfinished device such that the array is interposed between the first substrate and the frit layer, and the peripheral frit surrounds the array; and

melting and resolidifying at least part of the peripheral frit to form the frit seal so as to interconnect the unfinished device and the second substrate via the frit seal.

6. The method of claim 5 , wherein the frit layer is substantially non-transparent to visible light.

7. The method of claim 6 , wherein melting the peripheral frit comprises irradiating the peripheral frit with laser or infrared rays.

8. The method of claim 7 , wherein a wavelength of the laser or infrared rays are set to be from about 800 nm to about 1200 nm.

9. The method of claim 7 , further comprising masking at least a portion of the frit layer while irradiating the peripheral frit.

10. The method of claim 5 , wherein the peripheral frit is thicker than the frit layer, wherein the thickness is measured perpendicular to the surface of the second substrate.

11. The method of claim 5 , wherein the peripheral frit is applied to at least one of the first substrate and the second substrate in a form of a paste comprising a glass material and a filler material to adjust absorption characteristics, the method further comprising heating the peripheral frit to a temperature sufficient to cure the frit paste.

12. The method of claim 11 , wherein heating the frit paste comprises irradiating the frit paste with laser or infrared rays.

13. The method of claim 11 , wherein the frit paste is heated to a temperature in a range from about 300° C. to about 500° C.

14. An organic light-emitting device comprising:

a first substrate;

a second substrate;

an array of light-emitting pixels interposed between the first and the second substrate;

a frit layer formed between the second substrate and the array; and

a frit seal interconnecting the first substrate and the frit layer while surrounding the array such that the frit layer, the frit seal and the first substrate form an enclosed space where the array is located, wherein the frit seal is integral with and comprises the same composition as the frit layer and provides an exterior surface of the device;

wherein the frit layer and the frit seal comprises a glass material, at least one of a filler material to adjust absorption characteristics, and a different filler material to adjust thermal expansion characteristics.

15. An organic light-emitting device comprising:

a first substrate;

a second substrate;

an array of light-emitting pixels interposed between the first and the second substrates, wherein the second substrate is thinner in an inner portion opposite the array than in an outer portion surrounding the inner portion; and

a frit layer formed over the inner and the outer portions of the second substrate facing the first substrate such that the frit layer over the inner and outer portions in combination with the first substrate form an enclosed space where the array is located, wherein the first substrate and the second substrate are adhered to each other by the frit layer only in the outer portion, wherein the frit layer is substantially non-transparent to visible light, and wherein the frit layer provides an exterior surface of the device.

16. An organic light-emitting device comprising:

a first substrate;

a second substrate;

an array of light-emitting pixels interposed between the first and the second substrates, wherein the second substrate is thinner in an inner portion opposite the array than in an outer portion surrounding the inner portion; and

a frit layer formed over the inner and the outer portions of the second substrate facing the first substrate such that the frit layer over the inner and outer portions in combination with the first substrate form an enclosed space where the array is located, wherein the first substrate and the second substrate are adhered to each other by the frit layer in the outer portion, and the frit layer provides an exterior surface of the device;

wherein the frit layer is formed over the inner and outer portions of the second substrate in substantially the same thickness.