Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof
View Patent ↗A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.
1. A Cu—Zn alloy Sn plating strip superior in thermal peel resistance, that has
a Cu—Zn alloy strip that comprises 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, wherein the total concentration of P, As, Sb and Bi is 100 ppm by mass or less, the total concentration of Ca and Mg is 100 ppm by mass or less, the concentration of O is 30 ppm by mass or less, and the concentration of S is 30 ppm by mass or less, as a base material, and
wherein a plating coating is constructed by layers of an Sn phase, an Sn—Cu alloy phase, and optionally a Cu phase, in that order from the surface to the base material, wherein the thickness of the Sn phase is 0.1 to 1.5 μm, the thickness of the Sn—Cu alloy phase is 0.1 to 1.5 μm, and the thickness of the Cu phase is not more than 0.8 μm.
2. A Cu—Zn alloy Sn plating strip superior in thermal peel resistance, that has
a Cu—Zn alloy strip that comprises 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, wherein the total concentration of P, As, Sb and Bi is 100 ppm by mass or less, the total concentration of Ca and Mg is 100 ppm by mass or less, the concentration of O is 30 ppm by mass or less, and the concentration of S is 30 ppm by mass or less, as a base material, and
wherein a plating coating is constructed by layers of an Sn phase, Sn—Cu alloy phase, and an Ni phase, in that order from the surface to the base material, wherein the thickness of the Sn phase is 0.1 to 1.5 μm, the thickness of the Sn—Cu alloy phase is 0.1 to 1.5 μm, and the thickness of the Ni phase is 0.1 to 0.8 μm.
3. A Cu—Zn alloy Sn plating strip that comprises:
a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn, at least one selected from the group consisting of Sn, Ni, Si, Fe, Mn, Co, Ti, Cr, Zr, Al and Ag in a total concentration in the range of 0.01 to 5.0% by mass, and a balance of Cu and unavoidable impurities, wherein the total concentration of P, As, Sb and Bi is 100 ppm by mass or less, the total concentration of Ca and Mg is 100 ppm by mass or less, the concentration of 0 is 30 ppm by mass or less, and the concentration of S is 30 ppm by mass or less, as a base material, and
a plating coating constructed by layers of an Sn phase, an Sn—Cu alloy phase, and optionally a Cu phase surface, in that order from the surface to the base material,
wherein the thickness of the Sn phase is 0.1 to 1.5 μm, the thickness of the Sn—Cu alloy phase is 0.1 to 1.5 μm, and the thickness of the Cu phase is not more than 0.8 μm.
4. A Cu—Zn alloy Sn plating strip
a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn, at least one selected from the group consisting of Sn, Ni, Si, Fe, Mn, Co, Ti, Cr, Zr, Al and Ag in a total concentration in the range of 0.01 to 5.0% by mass, and a balance of Cu and unavoidable impurities, wherein the total concentration of P, As, Sb and Bi is 100 ppm by mass or less, the total concentration of Ca and Mg is 100 ppm by mass or less, the concentration of 0 is 30 ppm by mass or less, and the concentration of S is 30 ppm by mass or less, as a base material, and
a plating coating constructed by layers of an Sn phase, Sn—Cu alloy phase, and an Ni phase, in that order from the surface to the base material,
wherein the thickness of the Sn phase is 0.1 to 1.5 μm, the thickness of the Sn—Cu alloy phase is 0.1 to 1.5 μm, and the thickness of the Ni phase is 0.1 to 0.8 μm.