Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor
View Patent ↗There is provided an electronic part that has a substrate, an insulating layer formed on the substrate and a pad formed on the insulating layer and is electrically connected with an external terminal and that further includes a cavity formed at least at either one of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer. It provides a highly reliable electronic part, its fabrication method as well as an acceleration sensor using the electronic part and its fabrication method.
1. An electronic part, comprising:
a substrate;
an insulating layer formed on the substrate; and
an electrode pad formed on the insulating layer and electrically connected with an external terminal,
wherein a cavity is formed at at least one of a region of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer corresponding to the bottom surface of the electrode pad.
2. The electronic part according to claim 1 , wherein the electrode pad is connected with the external terminal via a bonding wire.
3. The electronic part according to claim 1 , wherein the electrode pad is connected with the external terminal via a bump.
4. The electronic part according to claim 1 , wherein the cavity is formed in the substrate so as to contact the insulating layer.
5. The electronic part according to claim 1 , wherein the cavity is formed inside the substrate.
6. The electronic part according to claim 1 , wherein the cavity is formed in the insulating layer.
7. The electronic part according to claim 6 , wherein the cavity contacts the substrate.
8. The electronic part according to claim 6 , wherein the cavity contacts the electrode pad.
9. The electronic part according to claim 6 , wherein the cavity contacts both of the substrate and the electrode pad.
10. The electronic part according to claim 1 , wherein the cavity is formed across the insulating layer and the substrate so as to contact with the electrode pad.
11. An improved acceleration sensor, having detector means for detecting acceleration, an electrode pad, a dead-weight section, and a substrate having a fixing section surrounding the dead-weight section, the dead-weight section being flexibly connected with the fixing section, wherein the improvement comprises:
an insulating layer is formed on the fixing section;
the electrode pad is disposed on the insulating layer and is electrically connected with the detecting means; and
a cavity is formed at least one of a region of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer corresponding to the bottom surface of the electrode pad.
12. The acceleration sensor according to claim 11 , wherein the electrode pad is connected with an external terminal via a bonding wire.
13. The acceleration sensor according to claim 11 , wherein the electrode pad is connected with an external terminal via a bump.
14. The acceleration sensor according to claim 11 , wherein the cavity is formed in the substrate so as to contact the insulating layer.
15. The acceleration sensor according to claim 11 , wherein the cavity is formed inside the substrate.
16. The acceleration sensor according to claim 11 , wherein the cavity is formed in the insulating layer.
17. The acceleration sensor according to claim 16 , wherein the cavity contacts the substrate.
18. The acceleration sensor according to claim 16 , wherein the cavity contacts the electrode pad.
19. The acceleration sensor according to claim 16 , wherein the cavity contacts both of the substrate and the electrode pad.
20. The acceleration sensor according to claim 11 , wherein the cavity is formed across the insulating layer and the substrate so as to contact with the electrode pad.
21. An electronic part, comprising:
a substrate having top and bottom sides;
an insulating layer on the top side of the substrate; and
an electrode pad on the insulating layer,
wherein a cavity is disposed between the bottom side of the substrate and the electrode pad, and
wherein a line drawn substantially perpendicular to the bottom side of the substrate passes through the cavity and the electrode pad.
22. An electronic part according to claim 21 , further comprising means, supported by the substrate, for detecting acceleration.