Detector system and detector subassembly
View Patent ↗A detector system with a microelectronic semiconductor chip and a separate optoelectronic detector chip is specified, wherein the detector chip is positioned on the semiconductor chip. A detector subassembly with such a detector system is also specified.
1. A detector system comprising:
a microelectronic semiconductor chip; and
a separate optoelectronic detector chip,
wherein the detector chip is positioned on the semiconductor chip;
wherein the detector chip is based on a compound semiconductor material or compound semiconductor materials; and
wherein the detector system is configured for use as an ambient light sensor operable to detect visible ambient light.
2. The detector system pursuant to claim 1 , wherein the semiconductor chip is designed to process a signal generated in the detector chip.
3. The detector system pursuant to claim 2 , wherein the semiconductor chip is designed as an amplifier to amplify the signal generated in the detector chip.
4. The detector system pursuant to claim 1 , wherein the detector chip is based on a III-V compound semiconductor material or III-V compound semiconductor materials.
5. The detector system pursuant to claim 1 , wherein the semiconductor chip is based on an elemental semiconductor material.
6. The detector-system pursuant to claim 1 , wherein the detector chip (is electrically connected to the semiconductor chip.
7. The detector system pursuant to claim 6 , wherein the detector chip is electrically connected to the semiconductor chip through an electrically conductive connecting layer located between the semiconductor chip and the detector chip.
8. The detector-system pursuant to claim 1 , wherein the detector chip is positioned on an input of the semiconductor chip.
9. The detector system pursuant to claim 1 , wherein the detector chip is fastened to the semiconductor chip.
10. The detector system pursuant to claim 1 , wherein the detector chip is joined to the semiconductor chip by means of an adhesive layer.
11. The detector system pursuant to claim 10 , wherein the adhesive layer is produced as an electrically conductive connecting layer.
12. The detector system pursuant to claim 1 , wherein a face of the detector chip facing away from the semiconductor chip is provided for grounding the detector chip.
13. The detector system pursuant to claim 1 , wherein the detector chip has a spectral sensitivity distribution that is shaped in accordance with a prescribed spectral sensitivity distribution.
14. The detector system pursuant to claim 13 , wherein the prescribed spectral sensitivity distribution is the sensitivity distribution of the human eye.
15. The detector system pursuant to claim 1 , wherein a height of the detector system is less than or equal to 500 μm.
16. The detector system pursuant to claim 1 , wherein a surface of the semiconductor chip facing away from the detector chip is provided as a mounting surface for mounting the detector system on a carrier element.
17. The detector system pursuant to claim 1 , wherein a surface of the semiconductor chip facing the detector chip is larger than a surface of the detector chip facing the semiconductor chip.
18. A detector subassembly with a detector system pursuant to claim 1 mounted on a carrier element.
19. The detector subassembly pursuant to claim 18 , wherein the semiconductor chip is positioned between the detector chip and the carrier element.
20. The detector subassembly pursuant to claim 18 , wherein the detector system is embedded in a shell transparent to radiation.
21. The detector subassembly pursuant to claim 18 , which is designed as a surface-mountable detector subassembly.