System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices
An integrated circuit includes a first and a second die positioned on a lead frame of a package. The lead frame includes a plurality of bond fingers. The integrated circuit includes a first bond pad on the first die that is electrically interconnected to a corresponding second bond pad on the second die through first and second bond fingers of the lead frame. The package may be a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame.
1. A method of routing signals within an integrated circuit, the integrated circuit comprising a first die and a second die each positioned on a lead frame of a package, the method comprising:
routing a signal from a first bond pad to a first bond finger of a first set of bond fingers in the lead frame, the first bond pad being located on the first die;
routing the signal from the first bond finger of the first set of bond fingers to a first bond finger of a second set of bond fingers in the lead frame; and
routing the signal from the first bond finger of the second set of bond fingers to a second bond pad, the second bond pad being located on the second die;
wherein the first set of bond fingers is configured to only route signals internal to the integrated circuit.
2. The method of claim 1 , further comprising:
routing a signal from a second bond finger of the first set of bond fingers in the lead frame to a second bond finger of the second set of bond fingers in the lead frame;
wherein the second set of bond fingers is configured to only route signals external to the integrated circuit.
3. The method of claim 1 , wherein routing a signal from the first bond pad to the first bond finger of the first set of bond fingers in the lead frame comprises coupling a bonding wire between i) the first bond pad and ii) the first bond finger of the first set of bond fingers.
4. The method of claim 3 , wherein routing the signal from the first bond finger of the second set of bond fingers to the second bond pad comprises connecting a bonding wire between i) the first bond finger of the second set of bond fingers and ii) the second bond pad.
5. The method of claim 1 , wherein the signal comprises an address signal, a data signal, or a control signal.
6. The method of claim 1 , wherein the package comprises a quad-flat package (QFP).
7. The method of claim 1 , wherein the first die is a dynamic random access memory (DRAM).
8. The method of claim 1 , wherein the second die is a memory controller.
9. The method of claim 1 , wherein the lead frame of the package includes a die paddle supported by four tie bars attached to respective corners of the die paddle.
10. The method of claim 1 , wherein the lead frame of the package comprises a die paddle, and the first die and the second die are each mounted to the die paddle.
11. The method of claim 1 , wherein:
each of the first die and the second die have respective inner edges that are adjacent to one another;
the first bond pad is positioned along one of an upper, a lower, and an outer edge of the first die; and
the second bond pad is positioned along one of an upper, a lower, and an outer edge of the second die.
12. The method of claim 11 , wherein:
the first bond pad is positioned along one of the upper, the lower, and the outer edge of the first die;
the second bond pad is positioned along a different one of the upper, the lower, and the outer edge of the second die; and
the first bond finger of the first set of bond fingers is electrically connected to a first bond finger of a second set of bond fingers through a conductive trace external to the package.