IP Library Granted Patent US 8,061,017
Granted Patent B2
US 8,061,017 · App. 12/393,596 · Granted Nov 22, 2011

Methods of making coil transducers

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Quick Facts
Patent No.
US 8,061,017
App. No.
12/393,596
Granted
Nov 22, 2011
Kind
B2
Abstract

Various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers are described and shown that are configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another.

Claims (23)

1. A method of making a coil transducer system, comprising:

forming a coil transducer comprising a generally planar substrate comprising opposing upper and lower surfaces and including therein a dielectric barrier, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive coil disposed above the upper surface of the substrate, the first coil extending between first and second coil input terminals disposed at opposite ends thereof; a second electrically conductive coil disposed below the lower surface of the substrate; the second coil extending between first and second output coil terminals disposed at opposite ends thereof; and

providing a transmitter circuit comprising first and second transmitter output terminals;

electrically connecting a first wire between the first transmitter output terminal and the first input coil terminal;

electrically connecting a second wire between the second transmitter output terminal and the second input coil terminal; and

configuring the first and second wires to be substantially parallel to one another, or to exhibit substantially similar angles respecting an azimuth extending along a major axis of the coil transducer, and have substantially a same first length such that the first and second wires are configured to minimize the pick-up of electromagnetic interference (“EMI”) thereby.

2. The method of claim 1 , wherein the first and second wires are electrically connected to the coil transducer and the transmitter circuit such that an angle between the first and second wires does not exceed about fifteen degrees.

3. The method of claim 1 , wherein the first and second wires are electrically connected to the coil transducer and the transmitter circuit such that the substantially similar angles thereof each range between about 0 degrees and about 10 degrees with respect to the major axis.

4. The method of claim 1 , wherein the first wire and the second wire are electrically extended a vertical distance over the transmitter circuit and the coil transducer that is substantially the same and does not exceed about 5 mils.

5. The method of claim 1 , wherein the first length is selected to range between about 5 mils and about 30 mils.

6. The method of claim 1 , wherein a horizontal separation is provided between the first wire and the second wire that does not exceed about 15 mils.

7. The method of claim 1 , further comprising providing a receiver circuit comprising first and second input receiver terminals.

8. The method of claim 7 , further comprising electrically connecting a third wire between the first receiver input terminal and the first output coil terminal, and electrically connecting a fourth wire between the second receiver input terminal and the second output coil, the third and fourth wires being substantially parallel to one another.

9. The method of claim 8 , wherein the third and fourth wires are configured to have substantially a same third length such that the pick-up of electromagnetic interference (“EMI”) thereby is minimized.

10. The method of claim 8 , wherein the third and fourth wires are electrically connected to the coil transducer and the transmitter circuit such that an angle between the third and fourth wires does not exceed about fifteen degrees.

11. The method of claim 8 , wherein the third wire and the fourth wire are extended a vertical distance over the receiver circuit and the coil transducer that does not exceed about 5 mils.

12. The method of claim 8 , wherein the third wire has a length selected to range between about 5 mils and about 30 mils.

13. The method of claim 8 , wherein a horizontal separation is provided between the third wire and the fourth wire that does not exceed about 15 mils.

14. The method of claim 8 , wherein a pair of substantially parallel wires is provided for each of the third wire and the fourth wire.

15. The method of claim 8 , wherein the receiver circuit is configured to provide differential output signals across the output terminals of the second coil.

16. The method of claim 1 , wherein at least one of the first coil and the second coil is formed to have a trace width not exceeding about 5 mils thereby to minimize the capacitance between the first and second coils.

17. The method of claim 1 , wherein a pair of substantially parallel wires is provided for each of the first wire and the second wire.

18. The method of claim 1 , wherein the transmitter circuit is configured to provide differential output signals across the input terminals of the first coil.

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 47630 FRAME: 344. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 21, 2019
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To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
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From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
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MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
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PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
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TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
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To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2009
From: FOUQUET, JULIE E.; TROTT, GARY; BAUMGARTNER, RICHARD A.
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 022317/0461 →