IP Library Granted Patent US 8,097,294
Granted Patent B2
US 8,097,294 · App. 12/212,040 · Granted Jan 17, 2012

Film forming method and electrooptic apparatus

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Quick Facts
Patent No.
US 8,097,294
App. No.
12/212,040
Granted
Jan 17, 2012
Kind
B2
Abstract

A method for forming a film by applying a material liquid to an application area of a base material and drying the applied material liquid includes: (a) forming a frame-shaped partition in the application area, the partition having a side surface facing a center of the application area; (b) applying the material liquid to the application area; and (c) drying the material liquid. In step (a), the partition is formed so that the side surface of the partition is closer to the center than an outer edge of the application area and so that a height of the partition is smaller than a film thickness of the material liquid at a time when the material liquid is applied and is larger than a thickness of the dried film.

Claims (12)

1. A method for forming a film by applying a material liquid to an application area of a base material and drying the applied material liquid, comprising:

(a) forming a frame-shaped partition along a periphery of the application area, the partition having a side surface facing a center of the application area;

(b) applying the material liquid to the application area; and

(c) drying the material liquid, wherein

in step (a), the partition is formed so that a distance between the side surface of the partition and the center is smaller than a distance between an outer edge of the application area and the center, and so that a height of the partition is smaller than a film thickness of the material liquid and at least a majority of a top surface of the partition is immersed in the material liquid at a time when the material liquid is applied, and the height of the partition is larger than a thickness of the dried film,

the film being an alignment film for controlling alignment of a liquid crystal molecule.

2. The method according to claim 1 , wherein

in step (a), the partition is formed in multiple layers from the center toward the outer edge.

3. The method according to claim 1 , wherein

in step (a), the partition is formed by applying the material liquid and then drying the applied material liquid.

4. The method according to claim 1 , wherein

in step (b), the material liquid is applied using a droplet discharge method.

Assignments (5)
SECURITY AGREEMENT Recorded Jan 23, 2020
From: KATEEVA, INC.
To: SINO XIN JI LIMITED
Reel/Frame 051682/0212 →
RELEASE OF SECURITY INTEREST Recorded Jan 22, 2020
From: EAST WEST BANK, A CALIFORNIA BANKING CORPORATION
To: KATEEVA, INC.
Reel/Frame 051664/0802 →
SECURITY INTEREST Recorded Apr 4, 2019
From: KATEEVA, INC.
To: EAST WEST BANK
Reel/Frame 048806/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2017
From: SEIKO EPSON CORP
To: KATEEVA, INC.
Reel/Frame 044719/0414 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2008
From: SUZUKI, KATSUMI
To: SEIKO EPSON CORPORATION
Reel/Frame 021542/0610 →