Micro-fluid ejection head and stress relieved orifice plate therefor
View Patent ↗A micro-fluid ejection head and methods for improving the fabrication and operation of the micro-fluid ejection head. The ejection head includes a photoimaged thick film layer attached to a substrate containing fluid ejection actuators. An orifice plate is laminated to the thick film layer. The orifice plate has a plurality of concentric orifices therein and is derived from a first photoresist material that is heated to a temperature sufficient to relieve film stresses in the photoresist material prior to exposing and developing the orifices in the orifice plate.
1. A method for making a micro-fluid ejection head, the method comprising the steps of:
applying a first photoresist layer to a device surface of a substrate containing fluid ejection actuators;
imaging a plurality of flow features in the first photoresist layer;
developing the imaged first photoresist layer to provide a thick film layer including the plurality of flow features therein;
applying a second photoresist layer to the thick film layer, the second photoresist layer having a thickness ranging from about 10 to about 30 microns;
applying a release liner to a surface of the second photoresist layer opposite to a surface attached to the thick film layer;
stress relieving the second photoresist layer;
removing the release liner from the second photoresist layer; and thereafter
imaging a plurality of nozzle holes in the second photoresist layer; and
developing the imaged second photoresist layer to provide a photoresist nozzle plate on the first photoresist layer.
2. The method of claim 1 , wherein the first photoresist layer is spin coated onto the substrate.
3. The method of claim 2 , wherein the first photoresist layer comprises a negative photoresist material.
4. The method of claim 1 , wherein the second photoresist layer is laminated to the thick film layer.
5. The method of claim 4 , wherein the second photoresist layer comprises a dry film photoresist material.
6. The method of claim 1 , wherein the stress relieving step comprises heating the substrate containing the thick film layer and second photoresist layer to a temperature sufficient to relieve stress in the second photoresist layer without curing the second photoresist layer.
7. The method of claim 1 , wherein second photoresist layer is applied to the thick film layer by laminating the second photoresist layer to the thick film layer as a dry film laminate.
8. A method for improving fluid ejection directionality from nozzles of a micro-fluid ejection head comprising:
applying a nozzle plate of a dry film photoresist material to a thick film layer containing flow features on a substrate that includes fluid ejection actuators;
heating the dry film photoresist material to a temperature sufficient to reduce stresses in the dry film photoresist material without curing the dry film photoresist material; and
imaging and developing the nozzles in the dry film photoresist material, wherein the dry film photoresist material comprises a release liner, further comprising removing the release liner from the dry film photoresist material after the heating and prior to the imaging and developing the nozzles.
9. The method of claim 8 , wherein the nozzles have a directionality axis for fluid ejection therefrom that is substantially perpendicular to a surface of the nozzle plate material.