Heatsink and semiconductor device with heatsink
View Patent ↗A heatsink carries a UV-ray light emitting diode. Flow passages for causing circulation of a fluid that cools the UV-ray light emitting diode are opened in the heatsink. Supply ports and discharge ports are opened in a mount surface of a header where supply and discharge of the fluid for cooling purpose to and from the heatsink are performed. A pair of circulation orifices corresponding to the supply port and the discharge port are opened in the contact surface that contacts the mount surface in the heatsink. Recesses are formed around the respective circulation orifices, and an annular sealing member that exhibits rubber elasticity and that is compressed between the heatsink and the header is disposed in each of the recesses.
1. A heatsink adapted to be coupled to a mount surface of a header in which a supply path and a discharge path for passing a cooling fluid are formed, the heatsink comprising:
a heatsink body which supports a heating element and in which a flow passage for the cooling fluid is formed therein, the heatsink body being coupled to the header so that a contact surface of the heatsink body is brought into contact with the mount surface of the header,
wherein a first circulation orifice through which the cooling fluid is introduced from the supply path and a second circulation orifice through which the cooling fluid is discharged to the discharge path are formed on the contact surface of the heatsink body,
a plurality of supply ports through which the cooling fluid is supplied to the first circulation orifice by communicating with the supply path and a plurality of discharge ports through which the cooling fluid is discharged communicating with the discharge path are formed on the mount surface of the header;
a plurality of the heatsink bodies are coupled to the header, and
the first circulation orifice is coupled to one of the supply ports in a watertight manner and the second circulation orifice is coupled to one of the discharge ports in a watertight manner,
wherein a sheet-shape sealing member is interposed between the heatsink body and the header so as to couple between the heatsink body and the header in a watertight manner, and
a supply hole which communicates the first circulation orifice and the supply port with each other and a discharge hole which communicates the second circulation orifice and the discharge port with each other are formed in the sealing member so as penetrate in a thickness direction of the sealing member.
2. A heatsink adapted to be coupled to a mount surface of a header in which a supply path and a discharge path for passing a cooling fluid are formed, the heatsink comprising:
a heatsink body which supports a heating element and in which a flow passage for the cooling fluid is formed therein, the heatsink body being coupled to the header so that a contact surface of the heatsink body is brought into contact with the mount surface of the header,
wherein a first circulation orifice through which the cooling fluid is introduced from the supply path and a second circulation orifice through which the cooling fluid is discharged to the discharge path are formed on the contact surface of the heatsink body,
a plurality of supply ports through which the cooling fluid is supplied to the first circulation orifice by communicating with the supply path and a plurality of discharge ports through which the cooling fluid is discharged by communicating with the discharge path are formed on the mount surface of the header;
a plurality of the heatsink bodies are coupled to the header, and
the first circulation orifice is coupled to one of the supply ports in a watertight manner and the second circulation orifice is coupled to one of the discharge ports in a watertight manner,
wherein a first receiving tube which communicates with the supply path at one end thereof and is opened to one of the supply ports at another end thereof and a second receiving tube which communicates with the discharge path at one end thereof and is opened to one of the discharge ports at another end thereof are formed in the header,
the heat sink body includes a pair of insertion tubes provided on the contact surface so as to project therefrom and so as to be inserted into the first and second receiving tubes in the header,
the first circulation orifice is penetrated in one of the insertion tubes, and the second circulation orifice is penetrated in another of the insertion tubes, and
sealing members are provided inside of the first and second receiving tubes and are brought into contact with outer peripheral surfaces of the insertion tubes, so that inner peripheral surfaces of the first and second receiving tubes and the outer peripheral surfaces of the insertion tubes are sealed in a watertight manner.
3. A heatsink adapted to be coupled to a mount surface of a header in which a supply path and a discharge path for passing a cooling fluid are formed, the heatsink comprising:
a heatsink body which supports a heating element and in which a flow passage for the cooling fluid is formed therein, the heatsink body being coupled to the header so that a contact surface of the heatsink body is brought into contact with the mount surface of the header,
wherein a first circulation orifice through which the cooling fluid is introduced from the supply path and a second circulation orifice through which the cooling fluid is discharged to the discharge path are formed on the contact surface of the heatsink body,
a plurality of supply ports through which the cooling fluid is supplied to the first circulation orifice by communicating with the supply path and a plurality of discharge ports through which the cooling fluid is discharged by communicating with the discharge path are formed on the mount surface of the header;
a plurality of the heatsink bodies are coupled to the header, and
the first circulation orifice is coupled to one of the supply ports in a watertight manner and the second circulation orifice is coupled to one of the discharge ports in a watertight manner,
wherein recesses are formed at least either around the first and second circulation orifices in the contact surface of the heatsink body or around at least one of the supply ports and at least one of the discharge ports in the mount surface of the header,
annular sealing members that exhibit rubber elasticity are disposed in the recesses, and
the heatsink body is joined to the header such that the sealing members are compressed between the heatsink body and the header.
4. The heatsink according to claim 1 , wherein the heating element is a light emitting diode.
5. The heatsink according to claim 1 , wherein the header is formed with an insulating synthetic resin material.
6. A semiconductor device comprising: the heat sink according to claim 1 , wherein the heating element is a semiconductor element, the heatsink body is provided with a stacked body including a base substrate provided with a metal plate and thermally coupled to the semiconductor element as well as electrically connected with one electrode of the semiconductor element, and a cover substrate provided with a metal plate and electrically connected with another electrode of the semiconductor element and an insulating material layer insulating between the base substrate and the cover substrate.
7. The heatsink according to claim 1 , wherein each of the plurality of the heatsink bodies is coupled to the header by a fastening member.
8. The heatsink according to claim 2 , wherein the heating element is a light emitting diode.
9. The heatsink according to claim 2 , wherein the header is formed with an insulating synthetic resin material.
10. A semiconductor device comprising: the heat sink according to claim 2 , wherein the heating element is a semiconductor element, the heatsink body is provided with a stacked body including a base substrate provided with a metal plate and thermally coupled to the semiconductor element as well as electrically connected with one electrode of the semiconductor element, and a cover substrate provided with a metal plate and electrically connected with another electrode of the semiconductor element and an insulating material layer insulating between the base substrate and the cover substrate.
11. The heatsink according to claim 2 , wherein each of the plurality of the heatsink bodies is coupled to the header by a fastening member.
12. The heatsink according to claim 3 , wherein the heating element is a light emitting diode.
13. The heatsink according to claim 3 , wherein the header is formed with an insulating synthetic resin material.
14. A semiconductor device comprising: the heat sink according to claim 3 , wherein the heating element is a semiconductor element, the heatsink body is provided with a stacked body including a base substrate provided with a metal plate and thermally coupled to the semiconductor element as well as electrically connected with one electrode of the semiconductor element, and a cover substrate provided with a metal plate and electrically connected with another electrode of the semiconductor element and an insulating material layer insulating between the base substrate and the cover substrate.
15. The heatsink according to claim 3 , wherein each of the plurality of the heatsink bodies is coupled to the header by a fastening member.