Wireless communication with a medical implant
View Patent ↗An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.
1. An apparatus for providing transdermal wireless communication, said apparatus comprising:
medical implant circuitry;
a transceiver coupled to the medical implant circuitry;
a first metal surface, the first metal surface having an end portion and a base portion;
a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer;
a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface, the first radiating element having
a first reactive portion at a first end thereof,
a second reactive portion at a second end thereof, and
a first radiating strip extending between the first reactive portion and the second reactive portion; and
a feed structure in electrical communication with the transceiver and the first radiating strip.
2. The apparatus of claim 1 , wherein the first reactive portion comprises a first capacitive structure, and the second reactive portion comprises a second capacitive structure.
3. The apparatus of claim 1 , wherein the first reactive portion comprises a first conductive planar portion having a dimension in excess of a width of the first radiating strip, and wherein the second reactive portion comprises a second conductive planar portion having a dimension in excess of the width of the first radiating strip.
4. The apparatus of claim 1 , wherein the first reactive portion comprises an inductive structure.
5. The apparatus of claim 1 , wherein the first reactive portion comprises a first conducting strip disposed to follow a first serpentine path, and the second reactive portion comprises a second conducting strip disposed to follow a second serpentine path.
6. The apparatus of claim 1 , wherein the first reactive portion of the first radiating element comprises an inductive structure and the second reactive portion comprises a capacitive structure.
7. The apparatus of claim 1 , wherein the feed structure is separated from the first radiating strip by a dielectric.
8. The apparatus of claim 1 , wherein the feed structure is capacitively coupled to the first radiating strip.
9. The apparatus of claim 1 , further comprising a second radiating element tuned to a second frequency, the second radiating element being disposed between the first reactive portion of the first radiating element and the second reactive portion of the first radiating element.
10. The apparatus of claim 9 , wherein the feed structure provides a signal of the first frequency and a signal of the second frequency to both the first radiating element and the second radiating element.
11. The apparatus of claim 9 , wherein the feed structure is capacitively coupled to both the first radiating element and the second radiating element.
12. The apparatus of claim 9 , wherein the second radiating element is tuned to a frequency between approximately 2 GHz and 2.5 GHz.
13. The apparatus of claim 1 , wherein a planar surface forms the second metal surface.
14. The apparatus of claim 13 , wherein the planar surface comprises a surface of a housing.
15. The apparatus of claim 1 , wherein the second metal surface comprises a planar surface of a housing.
16. The apparatus of claim 1 , wherein the end portion of the first metal surface is disposed over the first reactive portion of the first radiating element and wherein the base portion of the first metal surface is disposed over the second reactive portion of the first radiating element.
17. The apparatus of claim 1 , wherein the first radiating element defines a region at which an electric field supported by the first radiating element has its maximum amplitude, and wherein at least one of the end portion and base portion is disposed over the defined region.
18. The apparatus of claim 1 , wherein at least one of the end portion and base portion is disposed over a region at which a gradient vector of electric field amplitude reverses direction.
19. The apparatus of claim 1 , wherein at least one of the end portion and base portion is disposed to intercept electric field lines in a region at which an electric field supported by the first radiating element reaches its maximum amplitude.
20. The apparatus of claim 1 , wherein at least one of the end portion and base portion is disposed to block a selected portion of an electric field supported by the first radiating element.
21. The apparatus of claim 20 , wherein the selected portion of the electric field is a portion having an amplitude in excess of a threshold.
22. The apparatus of claim 20 , wherein the selected portion of the electric field is a portion having a gradient vector that reverses direction.
23. The apparatus of claim 1 , wherein the first radiating element is tuned to a first frequency within the MICS band.
24. The apparatus of claim 1 , wherein the first radiating element is tuned to a first frequency between 400 MHz and 405 MHz.
25. The apparatus of claim 1 , further comprising a neck extending between the end portion and the base portion.
26. The apparatus of claim 1 , wherein at least one of the first metal surface and the second metal surface comprises a planar surface.
27. The apparatus of claim 1 , where the first and second metal surfaces comprise grounded surfaces.
28. The apparatus of claim 1 , where the first and second metal surfaces comprise ground planes.
29. An apparatus for providing transdermal wireless communication in a selected direction, said apparatus comprising:
medical implant circuitry;
a transceiver coupled to the medical implant circuitry;
a first metal surface disposed in a plane perpendicular to the selected direction, the first metal surface having an end portion, and a base portion, and
a first planar radiating element tuned to a first frequency and disposed on a dielectric layer above the first metal surface, the first planar radiating element having
a first reactive portion at a first end thereof,
a second reactive portion at a second end thereof, and
a first planar radiating strip extending between the first reactive portion and the second reactive portion; and
a feed structure in electrical communication with the transceiver and the first planar radiating strip for providing a carrier signal to the first planar radiating strip.
30. The apparatus of claim 29 , further comprising a neck extending between the end portion and the base portion.