Sensor chip with connected non-metallic particles comprising a metallic coating
View Patent ↗The invention provides a chip comprising a substrate with at least one surface and a layer of particles having a non-metallic core and a coating made of a metal or a metal alloy, characterized in that each non-metallic core, on average, forms a metal-surrounded contact point with at least one other non-metallic core and/or the substrate surface. The invention also provides a method for preparing a chip, comprising the steps of, adsorbing non-metallic particles on said surface of the substrate, and, subsequently, adsorbing colloids of a metal on said non-metallic particles to provide the shell made of a metal or a metal alloy, and a chip which is obtainable by said method. The chip can be employed in optical devices for the detection of analytes.
1. A chip comprising:
a substrate with at least one, optionally dielectric, surface and, on top of said at least one surface,
a layer of particles having a non-metallic core and a coating made of a metal or a metal alloy, wherein
each non-metallic core, on average, has a surface area in direct contact with a surface area of at least one other non-metallic core and/or with the surface of the substrate, and
the surface area of the non-metallic core in direct contact is not coated by the metal or the metal alloy, while the surface area of the non-metallic core in direct contact is surrounded by the metal or the metal alloy to an extent of 220 degree or more.
2. A chip comprising a substrate with at least one surface and, on top of said at least one surface, a layer of particles having a non-metallic core and a coating made of a metal or a metal alloy, obtainable by
adsorbing non-metallic particles on said surface of the substrate, and, subsequently,
sputtering metal clusters or metal alloy clusters on said non-metallic particles, to provide the coating made of a metal or a metal alloy,
wherein each non-metallic core, on average, has a surface area in direct contact with a surface area of at least one other non-metallic core and/or with the surface of the substrate, and
the surface area of the non-metallic core in direct contact is not coated by the metal or the metal alloy, while the surface area of the non-metallic core in direct contact is surrounded by the metal or the metal alloy to an extent of 220 degree or more.
3. The chip according to claim 1 or claim 2 , wherein the metallic shell uniformly covers the free surface of the non-metallic cores, i.e. the surface not in contact with neither another core nor with the substrate surface.
4. The chip according to claim 1 or claim 2 , wherein the non-metallic core is of spherical shape and the metallic coating is also present in the hemisphere of the particles directed towards the substrate surface.
5. The chip according to claim 1 or claim 2 , wherein the coating is made of a transition metal or a transition metal alloy.
6. The chip according to claim 1 or claim 2 , wherein the substrate consists of a waveguiding material or comprises waveguiding elements.
7. The chip according to claim 1 or claim 2 , wherein the layer of the particles is a monolayer with a packing density of at least 35%.
8. The chip according to claim 1 or claim 2 , wherein the particles are present in a pattern on the surface,
wherein the pattern is sufficiently dense for contact point formation.
9. A method for preparing the chip according to claim 1 or claim 2 , comprising the steps of
adsorbing non-metallic particles on said surface of the substrate, and, subsequently,
sputtering metal clusters or metal alloy clusters on said non-metallic particles, to provide the coating made of a metal or a metal alloy.
10. An optical device for the detection of an analyte, comprising the chip according to claim 1 or claim 2 , an optical system for irradiating said chip, and a detection system for detecting the light reflected, transmitted, scattered or diffracted from said chip surface.
11. A method for determining the concentration of an analyte, comprising the steps of
detecting the light reflected, transmitted, scattered or diffracted from the chip according to claim 1 or claim 2 ,
bringing a solution potentially containing one or more analytes in contact with said chip, and
detecting the light reflected, transmitted, scattered or diffracted from said chip surface during or after exposure to the solution.
12. The chip according to claim 1 or claim 2 , wherein
the surface area of the non-metallic core in direct contact that is not coated by the metal or the metal alloy comprises a single-connected segment of the surface area of the non-metallic core,
the single-connected segment has a border with the metal or the metal alloy coating the non-metallic core,
the angle between a first radius from the center of the single-connected segment to one end of the border and a second radius from the center of the single-connected segment to the other end of the border amounts to 220 degrees or more.
13. The chip according to claim 1 or claim 2 , wherein a layer composed of a metal or a metal alloy is provided between the substrate and said layer of particles having a non-metallic core and a shell made of a transition metal or a transition metal alloy, and wherein each non-metallic core, on average, forms a metal-surrounded contact point with at least one other non-metallic core.
14. The chip according to claim 13 , wherein the layer composed of a metal or a metal alloy is composed of a transition metal, a transition metal alloy, or aluminium.
15. The chip according to claim 13 , wherein a non-metallic layer is provided between said layer composed of a transition metal or a transition metal alloy and said layer of particles.
16. The chip according to claim 1 or claim 2 , wherein binding agents capable of binding an analyte are immobilized on the surface of the chip.
17. The chip according to claim 16 , wherein a plurality of binding agents is immobilized on the surface in such a manner that different locations on the chip surface can be assigned to different binding agents.
18. A chip comprising a substrate with at least one surface and, on top of said at least one surface, a layer of particles having a non-metallic core and a coating made of a metal or a metal alloy, obtainable by
adsorbing non-metallic particles on said surface of the substrate, and, subsequently,
sputtering metal clusters or metal alloy clusters on said non-metallic particles, to provide the coating made of a metal or a metal alloy,
wherein each non-metallic core, on average, has a surface area in direct contact with a surface area of at least one other non-metallic core and/or with the surface of the substrate, and
the surface area of the non-metallic core in direct contact is not coated by the metal or the metal alloy, while the surface area of the non-metallic core in direct contact is surrounded by the metal or the metal alloy to an extent of 220 degree or more.