IP Library Granted Patent US 8,342,021
Granted Patent B2
US 8,342,021 · App. 12/705,764 · Granted Jan 1, 2013

Composite sensor and electronic device

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Quick Facts
Patent No.
US 8,342,021
App. No.
12/705,764
Granted
Jan 1, 2013
Kind
B2
Abstract

A composite sensor includes: a package including a container and a lid; a plurality of spaces that is partitioned by at least the container and the lid, and has different pressures, the plurality of the spaces including a first space sealed at around an atmospheric pressure and a second space sealed at a depressurized state; an acceleration sensor element disposed in the first space; and a vibration type angular velocity sensor element disposed in the second space. In the sensor, the first space has a volume smaller than a volume of the second space.

Claims (13)

1. A composite sensor, comprising:

a package including a first space having a first pressure and a first thickness, and the package including a second space having a second pressure lower than the first pressure and a second thickness;

an acceleration sensor element disposed in the first space; and

a vibration type angular velocity sensor element disposed in the second space, wherein the first space has a volume smaller than a volume of the second space, and the first thickness is smaller than the second thickness.

2. The composite sensor according to claim 1 , the package including a container, a lid and a partitioned member, the first space and the second space is partitioned by the partitioned member.

3. The composite sensor according to claim 1 , wherein at least one of a wall forming the first space and a wall forming the second space has a through hole, the through hole is sealed by a sealing member.

4. The composite sensor according to claim 1 , wherein a height of a bottom surface forming the first space and a height of a bottom surface forming the second space are different from each other.

5. The composite sensor according to claim 2 , wherein at least one of the container and the lid has a layered structure.

6. An electronic device comprising the composite sensor according to claim 1 .

7. An electronic device comprising the composite sensor according to claim 2 .

8. An electronic device comprising the composite sensor according to claim 3 .

9. An electronic device comprising the composite sensor according to claim 4 .

10. An electronic device comprising the composite sensor according to claim 5 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2020
From: SEIKO EPSON CORPORATION
To: 138 EAST LCD ADVANCEMENTS LIMITED
Reel/Frame 051707/0399 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2010
From: OSHIO, MASAHIRO
To: SEIKO EPSON CORPORATION
Reel/Frame 023935/0773 →