Sandwich of impact resistant material
A sandwich of impact resistant material comprising: a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value; a second tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the second tile and the second tile comprises a hardness value; and a third tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the third tile and the third tile comprises a hardness value, wherein the second tile is coupled in between the first tile and the third tile, and the second tile comprises a hardness value greater than the first tile and the second tile.
1. A method of making a sandwich of impact resistant material, the method comprising:
providing a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value;
providing a second tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the second tile and the second tile comprises a hardness value;
providing a third tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the third tile and the third tile comprises a hardness value; and
coupling the second tile in between the first tile and the third tile,
wherein the second tile comprises a hardness value greater than the first tile and third tile.
2. The method of claim 1 , wherein:
the hardness value of the first tile is between 1000 and 1500 HV;
the hardness value of the second tile is between 2500 and 3500 HV; and
the hardness value of the third tile is between 1000 and 1500 HV.
3. The method of claim 1 , wherein the nano-particles that form first tile and the third tile comprise silicon nitride nano-particles.
4. The method of claim 1 , wherein the nano-particles that form the second tile comprise tungsten carbide nano-particles, tantalum carbide nano-particles, or titanium carbide nano-particles.
5. The method of claim 1 , wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 1 to 10 nanometers.
6. The method of claim 1 , wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 10 to 50 nanometers.
7. The method of claim 1 , wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 50 to 100 nanometers.
8. The method of claim 1 , wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 100 to 250 nanometers.
9. The method of claim 1 , wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 250 to 500 nanometers.
10. The method of claim 1 , wherein the second tile is coupled between the first tile and the third tile via adhesive layers.
11. The method of claim 1 , wherein coupling the second tile in between the first tile and the third tile comprises performing a spark plasma sintering process on the nano-particles of the first tile, the second tile, and the third tile.
12. The method of claim 1 , further comprising a ductile backing layer coupled to the third tile on a side opposite the second tile.
13. The method of claim 12 , wherein the ductile backing layer comprises an adhesive layer.
14. The method of claim 12 , wherein the ductile backing layer comprises:
a layer of polyethylene fibers; and
an adhesive material.