Semiconductor device and method for manufacturing the same
View Patent ↗There is provided a method for manufacturing a semiconductor device, including, forming a first insulating film on a semiconductor substrate, forming a capacitor on the first insulating film, forming a second insulating film covering the capacitor, forming a metal wiring on the second insulating film, forming a first capacitor protective insulating film covering the metal wiring and the second insulating film, forming an insulating sidewall on a side of the metal wiring, forming a third insulating film on the insulating sidewall, forming a hole by etching the third insulating film under a condition that an etching rate of the insulating sidewall would be lower than that of the third insulating film, and forming a conductive plug inside the hole.
1. A semiconductor device comprising:
a semiconductor substrate;
a first insulating film formed over the semiconductor substrate;
a capacitor formed over the first insulating film, the capacitor being constructed from a lower electrode, a capacitor dielectric film made of a ferroelectric material, and an upper electrode;
a second insulating film formed over the capacitor;
a metal wiring formed over the second insulating film;
a first capacitor protective insulating film formed at least on a side surface of the metal wiring;
an insulating sidewall formed on the first capacitor protective insulating film on beside the metal wiring;
a third insulating film formed over the metal wiring and the insulating sidewall, the third insulating film having a hole over the metal wiring;
a conductive plug formed in the hole, the conductive plug being connected to the metal wiring; and
a second capacitor protective insulating film formed over the third insulating film.
2. The semiconductor device according to claim 1 , wherein the insulating sidewall is made of any one of silicon nitride and silicon oxynitride, and the third insulating film is made of silicon oxide.
3. The semiconductor device according to claim 1 , wherein the first capacitor protective insulating film is formed on upper surfaces of the second insulating film and the metal wiring.
4. The semiconductor device according to claim 1 , wherein the first capacitor protective insulating film is made of an alumina film.
5. A semiconductor device comprising:
a semiconductor substrate;
a first insulating film formed over the semiconductor substrate;
a capacitor formed over the first insulating film, the capacitor being constructed from a lower electrode, a capacitor dielectric film made of a ferroelectric material, and an upper electrode;
a second insulating film formed over the capacitor;
a metal wiring formed over the second insulating film;
a first capacitor protective insulating film formed on upper surfaces of the second insulating film and the metal wiring;
an insulating sidewall formed on the first capacitor protective insulating film on beside the metal wiring;
a third insulating film formed on the first capacitor protective insulating film and the insulating sidewall, the third insulating film having a hole over the metal wiring and made of a different material from a material of which the insulating sidewall is made; and
a conductive plug formed in the hole, the conductive plug being connected to the metal wiring.
6. The semiconductor device according to claim 5 , wherein the insulating sidewall is made of any one of silicon nitride and silicon oxynitride, and the third insulating film is made of silicon oxide.
7. The semiconductor device according to claim 5 , wherein the first capacitor protective insulating film is made of an alumina film.
8. The semiconductor device according to claim 5 , wherein a second capacitor protective insulating film is formed over the third insulating film.