Electro-deposited passivation coatings for patterned media
A method of fabricating a magnetic recording disk including providing a magnetic recording layer having a pattern of raised areas and recessed areas formed thereon and providing a mask layer on the raised areas of the magnetic recording layer. The method further including electrodepositing a first protection layer on the magnetic recording layer, removing the mask layer, and depositing a second protection layer above the first protection layer.
1. A method of fabricating a magnetic recording disk, comprising:
providing a magnetic recording layer having a pattern of raised magnetic areas formed directly on a magnetic portion of the magnetic recording layer, wherein recessed areas are present between the raised magnetic areas;
providing a mask layer on the raised magnetic areas of the magnetic recording layer;
electrodepositing a first protection layer only in recessed areas of the magnetic recording layer;
removing the mask layer; and
depositing a second protection layer above the first protection layer.
2. The method of claim 1 , wherein electrodepositing comprises electroplating.
3. The method of claim 1 , the first protection layer comprises a metal.
4. The method of claim 1 , wherein the first protection layer comprises aluminum.
5. The method of claim 1 , wherein the first protection layer comprises a silicate.
6. The method of claim 1 , wherein the first protection layer comprises an insulator.
7. The method of claim 6 , further comprising baking the first protection layer after electrodepositing and before depositing the second protection layer.
8. The method of claim 1 , where the first protection layer comprises an aluminate.
9. The method of claim 1 , wherein the first protection layer comprises a material selected from a group consisting of aluminum, gold, copper, chromium, ruthenium, platinum and rhodium.
10. The method of claim 1 , wherein after electroplating the method further comprises:
rinsing the first protection layer; and
annealing the first protection layer before removing the mask layer.
11. The method of claim 10 , wherein the masking layer comprises a non-conductive material.
12. The method of claim 1 , wherein the first protection layer has a thickness less than 1 micron.
13. The method of claim 1 , further comprising electrodepositing one or more additional films on the first protection layer before depositing the second protection layer.