IP Library Granted Patent US 8,993,939
Granted Patent B2
US 8,993,939 · App. 13/424,947 · Granted Mar 31, 2015

Resistance heater

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Quick Facts
Patent No.
US 8,993,939
App. No.
13/424,947
Granted
Mar 31, 2015
Kind
B2
Abstract

A resistance heater is shown and described. The resistance heater may include a body. The body may include at least one heating surface, the heating surface being generally smooth and generally flat and a recess formed in the body, at least a portion of the body having a cross-sectional shape selected from the group consisting of: generally U shape, generally I-shape, and generally H-shape, and where the cross-sectional shape extends along at least a portion of the body.

Claims (34)

1. A resistance heater comprising:

a body comprising:

at least one heating surface defined by the body, the heating surface being generally smooth and generally flat;

a recess formed in at least a portion of the body, wherein the portion has a cross-sectional shape selected from the group consisting of: generally U shape, generally I-shape, and generally H-shape; and

wherein the cross-sectional shape extends along at least a portion of the length of the body.

2. The resistance heater of claim 1 , wherein the cross-sectional shape extends along a majority of the length of the body.

3. The resistance heater of claim 1 , wherein the body further includes first and second end portions and wherein the recess is not formed in the first and second end portions.

4. The resistance heater of claim 3 wherein the first and second end portions include a terminal connecting hole.

5. The resistance heater of claim 4 , wherein the first and second end portions have substantially identical width to a heating area defined between the first and second end portions, and said recess is not formed at the first and second end portions.

6. The resistance heater of claim 1 , wherein the body has a substantially uniform width along the length.

7. The resistance heater of claim 1 wherein the body is fabricated from at least one of graphite and ceramic material.

8. The resistance heater of claim 1 wherein the body is coated with at least one of pBN and SiC.

9. A method for processing a semiconductor wafer comprising the steps of:

a) providing a resistance heater having a body having at least one heating surface defined by the body, the heating surface being generally smooth and generally flat; a recess formed in at least a portion of the body, wherein the portion has a generally horizontally symmetrical cross-sectional shape; and wherein the cross-sectional shape extends along at least a portion of the length of the body;

b) supporting a semiconductor wafer on the at least one heating surface;

c) applying an electric current to the heater; and

d) heating the semiconductor wafer to a predetermined temperature.

10. The method of claim 9 , wherein the body further includes first and second end portions and wherein the recess is not formed in the first and second end portions.

11. The method of claim 10 wherein the first and second end portions include a terminal connecting hole.

12. The method of claim 11 , wherein the first and second end portions have substantially identical width to a heating area defined between the first and second end portions, and said recess is not formed at the first and second end portions.

13. The method of claim 9 wherein the body is coated with at least one of pBN and SiC.

14. A resistance heater comprising:

a body comprising:

at least one heating surface defined by the body, the heating surface being generally smooth and generally flat;

a recess formed in at least a portion of the body, wherein the portion has a generally horizontally symmetrical cross-sectional shape; and

wherein the cross-sectional shape extends along at least a portion of the length of the body.

15. The resistance heater of claim 14 , wherein the cross-sectional shape of at least a portion the body is generally I-shaped or H-shaped.

16. The resistance heater of claim 14 , wherein recess is formed in portions of both first and second surfaces of the body forming a generally I-shaped cross-sectional shape.

17. The resistance heater of claim 16 , wherein the first and second surfaces are top and bottom surfaces of the body, respectively.

18. The resistance heater of claim 14 , wherein recess is formed in portions of both first and second surfaces of the body forming a generally H-shaped cross-sectional shape.

19. The resistance heater of claim 18 , wherein the first and second surfaces are opposite side surfaces of the body.

20. The resistance heater of claim 14 , wherein the body has a substantially uniform width along its length.

21. The method of claim 9 , wherein the cross-sectional shape of at least a portion of the body is selected from the group consisting of: generally U shape, generally I-shape, and generally H-shape.

22. The method of claim 21 , wherein the cross-sectional shape comprises a majority of the length of the body.

Assignments (21)
PATENT SECURITY AGREEMENT Recorded May 23, 2025
From: MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
To: STANDARD CHARTERED BANK, AS COLLATERAL AGENT AND ADMINISTRATIVE AGENT
Reel/Frame 071368/0854 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Mar 31, 2023
From: BNP PARIBAS
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 063259/0133 →
RELEASE OF SECURITY INTEREST Recorded Mar 30, 2023
From: KOOKMIN BANK NEW YORK
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 063197/0373 →
NUNC PRO TUNC ASSIGNMENT Recorded Feb 4, 2021
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
Reel/Frame 055222/0140 →
FIRST LIEN TERM LOAN PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: BNP PARIBAS, AS ADMINISTRATIVE AGENT
Reel/Frame 049387/0782 →
ABL PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049388/0252 →
SECOND LIEN TERM LOAN PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: KOOKMIN BANK, NEW YORK BRANCH, AS ADMINISTRATIVE AGENT
Reel/Frame 049388/0220 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded May 21, 2019
From: JPMORGAN CHASE BANK, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 050304/0555 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049249/0271 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049194/0085 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035136/0457 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY - SECOND LIEN Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035137/0263 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 20, 2014
From: JPMORGAN CHASE BANK, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034410/0597 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 30, 2014
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034113/0331 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0662 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0570 →
SECURITY AGREEMENT Recorded Apr 29, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 030311/0343 →
SECURITY AGREEMENT Recorded Apr 25, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 030295/0361 →
SECURITY AGREEMENT Recorded Apr 25, 2013
From: MOMENTIVE PERFORMANCE MATERIALS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 030290/0755 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 030185/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2012
From: MORIKAWA, YUJI; MATSUI, YOSHIHIKO; OTAKA, AKINOBU; HIGUCHI, TAKESHI; FUJIMURA, KENSUKE; LU, ZHONG-HAO
To: MOMENTIVE PERFORMANCE MATERIALS, INC.
Reel/Frame 028249/0882 →