System for thermal control of red LED(s) chips
View Patent ↗A light emitting diode assembly includes a first light emitting diode disposed on a first substrate and a second light emitting diode disposed on a second substrate that is disposed substantially adjacent to the first substrate. The second light emitting diode has a higher rate of performance degradation over time due to temperature than the first light emitting diode. A heat sink is thermally coupled to the first substrate and an electrical cooling circuit is thermally coupled to the second substrate. The electrical cooling circuit is configured to reduce a temperature of the second substrate when the electrical cooling circuit is electrically energized.
1. A light emitting diode assembly, comprising:
a first substrate and a second substrate;
a heat sink thermally coupled to the first substrate and the second substrate;
a first light emitting diode disposed on the first substrate;
a second light emitting diode disposed on the second substrate, the second substrate being disposed substantially adjacent to the first substrate, the second light emitting diode have a higher rate of performance degradation over time due to temperature than the first light emitting diode;
an electrical cooling circuit thermally coupled to the second substrate and the heat sink, the electrical cooling circuit being configured to reduce a temperature of the second substrate when the electrical cooling circuit is electrically energized.
2. The light emitting diode assembly of claim 1 , comprising:
a controller coupled to the electrical cooling circuit, the controller configured to regulate a heat extraction capability of the electrical cooling circuit.
3. The light emitting diode assembly of claim 2 , comprising:
a sensor coupled to the second substrate and the controller, and configured to detect the temperature of the second substrate and provide a temperature signal to the controller.
4. The light emitting diode assembly of claim 1 , wherein the electrical cooling circuit comprises a thermoelectric device.
5. The light emitting diode assembly of claim 4 , wherein the thermoelectric device comprises a Peltier thermoelectric device.
6. The light emitting device of claim 1 , wherein the electrical cooling circuit is configured to control the temperature of the second light emitting diode independently of the first light emitting diode.
7. The light emitting device of claim 1 , wherein the first light emitting diode on the first substrate is disposed adjacent to the second light emitting diode on the second substrate.
8. The light emitting device of claim 1 , wherein each of the first light emitting diode and the second light emitting diode comprise a light emitting diode array.
9. The light emitting device of claim 1 , wherein the electrical cooling circuit is configured to reduce the temperature of the second substrate to a temperature at which a performance degradation curve of the second light emitting diode will substantially match a performance degradation curve of the first light emitting diode at a higher temperature.
10. The light emitting device of claim 1 , wherein the first light emitting diode is a white light emitting diode and the second light emitting diode is a red light emitting diode.
11. An illumination assembly, comprising:
a light emitting diode array arranged on a common heat dissipation platform, the light emitting diode array including a first light emitting diode and a second light emitting diode, the second light emitting diode have a higher rate of performance degradation over time due to temperature than the first light emitting diode;
wherein the common heat dissipation platform comprises:
a thermoelectric cooling device coupled to the second light emitting diode;
a heat sink thermally coupled to the first light emitting diode and the thermoelectric cooling device; and
a controller electrically coupled to the thermoelectric cooling device and configured to regulate a cooling capability of the thermoelectric cooling device based on a detected operating temperature of the second light emitting diode and maintain an operating temperature of the second light emitting diode at a temperature that is less than an operating temperature of the first light emitting diode.
12. The illumination assembly of claim 11 , wherein the thermoelectric cooling device comprises a Peltier thermoelectric device.
13. The illumination assembly of claim 11 , wherein the controller is configured to regulate the thermoelectric device independently of the operating temperature of the first light emitting diode.
14. The illumination assembly of claim 11 , comprising:
a first substrate on which the first light emitting diode is disposed; and
a second substrate, adjacent to the first substrate, on which the second light emitting diode is disposed.
15. The illumination assembly of claim 14 , wherein the first substrate is physically separated from the second substrate.
16. The illumination assembly of claim 14 , wherein one side of the first substrate is thermally coupled to the heat sink, one side of the second substrate is coupled to the heat sink, and a second side of the second substrate is thermally coupled to the thermoelectric device.
17. The illumination assembly of claim 11 , wherein the thermoelectric cooling device is configured to reduce the operating temperature of the second light emitting diode to an operating temperature at which a performance degradation curve of the second light emitting diode substantially matches a performance degradation curve of the first light emitting diode at a higher operating temperature.
18. The illumination assembly of claim 11 , wherein the controller is configured to:
determine a power consumption of the second light emitting diode; and
determine a power to be applied to the thermoelectric cooling device to maintain the operating temperature of the second light emitting diode based on the power consumption of the second light emitting diode.
19. The illumination assembly of claim 11 , wherein the first light emitting diode is a white light emitting diode and the second light emitting diode is a red light emitting diode.
20. The light emitting device of claim 1 , wherein the first substrate includes an opening and the second substrate is disposed within the opening.
21. The light emitting device of claim 1 , wherein the first substrate is concentrically arranged around the second substrate.
22. A light emitting diode assembly, comprising:
a heat dissipation platform;
a first substrate disposed on the heat dissipation platform;
a second substrate disposed on the heat dissipation platform;
an array of white LEDs disposed on the first substrate;
an array of red LEDs disposed on the second substrate; and
wherein the heat dissipation platform comprises:
a heat sink and a cooling circuit, the first substrate and the second substrate being thermally coupled to the heat sink and the cooling circuit thermally coupling the second substrate and the heat sink; and
wherein the first substrate includes an opening, the cooling circuit being disposed within the opening.