IP Library Granted Patent US 9,053,405
Granted Patent B1
US 9,053,405 · App. 14/162,483 · Granted Jun 9, 2015

Printed RFID circuit

Inventors: Weifeng Liu (Dublin, CA); Anwar Mohammed (San Jose, CA); Murad Kurwa (San Jose, CA)
Assignee: Flextronics AP, LLC
G06K19/07754H01M6/40H04B1/3816
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Quick Facts
Patent No.
US 9,053,405
App. No.
14/162,483
Granted
Jun 9, 2015
Kind
B1
Abstract

A printed circuit including a non-conductive substrate, a first conductive layer printed on the non-conductive substrate and one or more additional layers printed on the substrate. The first conductive layer is able to have one or more antennas each forming a predetermined pattern, a first conductive sheet and one or more conductive traces. The one or more additional layers include a first electrode printed on the top of the first conductive sheet, a buffer printed on top of the first electrode, a second electrode printed on top of the buffer and a second conductive sheet printed on top of the second electrode. The printed circuit is further able to include an RFID chip electrically coupled with the antennas and at least one of the first and second conductive sheets via the conductive traces, wherein the first and second conductive sheets, the buffer and the first and second electrodes form a power source that provides electrical power to the RFID chip.

Claims (44)

1. A printed circuit comprising:

a non-conductive substrate;

a first conductive layer printed on the non-conductive substrate comprising:

one or more antennas each forming a predetermined pattern;

a first conductive sheet; and

one or more conductive traces;

one or more additional layers printed on the non-conductive substrate comprising:

a first electrode printed on the top of the first conductive sheet;

a buffer printed on top of the first electrode;

a second electrode printed on top of the buffer; and

a second conductive sheet printed on top of the second electrode; and

an RFID chip electrically coupled with the antennas and at least one of the first and second conductive sheets via the conductive traces;

wherein the first and second conductive sheets, the buffer and the first and second electrodes form a power source that provides electrical power to the RFID chip.

2. The printed circuit of claim 1 , wherein the RFID chip is the only non-printed element on the substrate forming the printed circuit.

3. The printed circuit of claim 1 , wherein the power source comprises a printed battery and the buffer comprises an electrolyte that isolates the first and second electrodes.

4. The printed circuit of claim 3 , wherein the electrolyte has a lateral perimeter that is slightly larger than the lateral perimeter of the first and second electrodes such that the first and second electrodes do not extend beyond the lateral perimeter of the electrolyte.

5. The printed circuit of claim 1 , wherein the power source comprises a printed battery and the buffer comprises a photoactive layer and a transport layer.

6. The printed circuit of claim 1 , further comprising one or more printed electrical components, wherein each of the printed electrical components are at least partially printed within the first conductive layer and the remainder of the printed electrical components are printed within the additional layers.

7. The printed circuit of claim 6 , wherein the printed electrical components comprise one or more of printed resistors, printed capacitors, printed light-emitting diodes and printed memory cells.

8. The printed circuit of claim 1 , wherein the RFID chip is electrically coupled to the traces with a conductive adhesive.

9. The printed circuit of claim 1 , wherein the entirety of the first conductive layer is formed by a single conductive material.

10. The printed circuit of claim 9 , wherein the single conductive material is one of copper, palladium, gold, silver, and nickel.

11. A method of manufacturing a printed circuit, the method comprising:

providing a non-conductive substrate;

printing a first conductive layer onto the substrate, the first conductive layer comprising:

one or more antennas each forming a predetermined pattern;

a first conductive sheet; and

one or more conductive traces;

printing one or more additional layers onto the substrate, the additional layers comprising:

a first electrode printed on the top of the first conductive sheet;

a buffer printed on top of the first electrode;

a second electrode printed on top of the buffer; and

a second conductive sheet printed on top of the second electrode; and

placing an RFID chip on the substrate and electrically coupling the RFID chip with the antennas and at least one of the first and second conductive sheets via the conductive traces;

wherein the first and second conductive sheets, the buffer and the first and second electrodes form a power source that provides electrical power to the RFID chip.

12. The method of claim 11 , wherein the RFID chip is the only non-printed element on the substrate forming the printed circuit.

13. The method of claim 11 , wherein the power source comprises a printed battery and the buffer comprises an electrolyte that isolates the first and second electrodes.

14. The method of claim 13 , wherein the electrolyte has a lateral perimeter that is slightly larger than the lateral perimeter of the first and second electrodes such that the first and second electrodes do not extend beyond the lateral perimeter of the electrolyte.

15. The method of claim 11 , wherein the power source comprises a printed battery and the buffer comprises a photoactive layer and a transport layer.

16. The method of claim 11 , wherein the first conductive layer comprises at least a portion of one or more printed electrical components and the additional layers comprise the remainder of the printed electrical components.

17. The method of claim 15 , wherein the printed electrical components comprise one or more of printed resistors, printed capacitors, printed light-emitting diodes and printed memory cells.

18. The method of claim 11 , wherein the RFID chip is electrically coupled to the traces with a conductive adhesive.

19. The method of claim 11 , wherein the entirety of the first conductive layer is formed by a single conductive material via a single printing process.

20. The method of claim 19 , wherein the single conductive material is one of copper, palladium, gold, silver, and nickel.

Assignments (9)
SECURITY INTEREST Recorded Jun 2, 2025
From: BRIGHT MACHINES, INC.; BRIGHT MACHINES AUTOMATION CORP.
To: STIFEL BANK
Reel/Frame 071467/0419 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL AT REEL/FRAME NO. 67201/0797 Recorded Jun 2, 2025
From: JPMORGAN CHASE BANK, N.A.
To: BRIGHT MACHINES, INC.
Reel/Frame 071851/0097 →
TERMINATION AND RELEASE OF INTELLECTUAL PROPERTY SECURITY AGREEMENT AT REEL/FRAME NO. 58085/0124 Recorded May 29, 2025
From: HERCULES CAPITAL, INC.
To: BRIGHT MACHINES, INC.
Reel/Frame 071460/0482 →
TERMINATION AND RELEASE OF INTELLECTUAL PROPERTY SECURITY AGREEMENT AT REEL 057911 FRAME 0323 Recorded Apr 25, 2024
From: SILICON VALLEY BANK, A DIVISION OF FIRST-CITIZENS BANK & TRUST COMPANY (SUCCESSOR TO SILICON VALLEY BANK)
To: BRIGHT MACHINES, INC.
Reel/Frame 067238/0600 →
SECURITY INTEREST Recorded Apr 23, 2024
From: BRIGHT MACHINES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067201/0797 →
SECURITY INTEREST Recorded Nov 11, 2021
From: BRIGHT MACHINES, INC.
To: HERCULES CAPITAL, INC.
Reel/Frame 058085/0124 →
SECURITY INTEREST Recorded Oct 26, 2021
From: BRIGHT MACHINES, INC.; BRIGHT MACHINES AUTOMATION CORP.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 057911/0323 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2021
From: FLEXTRONICS AP, LLC
To: BRIGHT MACHINES, INC.
Reel/Frame 055707/0012 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2014
From: LIU, WEIFENG; MOHAMMED, ANWAR; KURWA, MURAD
To: FLEXTRONICS AP, LLC
Reel/Frame 032032/0190 →
Continuity (1)
Provisional Application 61870627 · Aug 27, 2013