IP Library Granted Patent US 10,128,310
Granted Patent B2
US 10,128,310 · App. 15/261,798 · Granted Nov 13, 2018

Magnetoresistive memory device and manufacturing method of the same

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Quick Facts
Patent No.
US 10,128,310
App. No.
15/261,798
Granted
Nov 13, 2018
Kind
B2
Abstract

According to one embodiment, a magnetoresistive memory device includes a magnetoresistive element of a stacked layer structure includes a first magnetic layer, a second magnetic layer, and a nonmagnetic layer between the first and second magnetic layers, and an insulating layer of a group III-V compound provided on a side of the first magnetic layer of the magnetoresistive element, the insulating layer including an chemical element of group II, group IV, or group VI.

Claims (15)

1. A magnetoresistive memory device comprising:

a magnetoresistive element of a stacked layer structure comprising a first magnetic layer, a second magnetic layer, and a nonmagnetic layer between the first and second magnetic layers; and

an insulating layer of a group III-V compound provided on a side of the first magnetic layer of the magnetoresistive element, the insulating layer including an additional element from one of group II, group IV, and group VI.

2. The device of claim 1 , wherein:

the first magnetic layer is a storage layer in which a magnetization direction is variable;

the nonmagnetic layer is a tunnel barrier layer; and

the second magnetic layer is a reference layer in which a magnetization direction is fixed.

3. The device of claim 2 , further comprising a shift canceling layer which reduces a stray magnetic field caused by the reference layer, the shift canceling layer being provided on the reference layer, opposite to the storage layer.

4. The device of claim 1 , further comprising a conductive buffer layer provided on the insulating layer, opposite to the first magnetic layer.

5. The device of claim 1 , wherein the insulating layer includes the additional element at an end portion.

6. The device of claim 5 , wherein an end portion of the second magnetic layer is located at a more interior side than the end portion of the insulating layer.

7. The device of claim 1 , wherein the insulating layer is AIN, GaN, InN, MgO or SiN.

8. The device of claim 1 , wherein the additional element is at least one element selected from the group consisting of Be, Mg, Ca, Sr, Ba, C, Si, Ge, Sn, S, Se, and Te.

9. The device of claim 1 , further comprising a substrate provided with a select transistor, and an electrode connected to one of a source and a drain of the select transistor, on a side of the insulating layer of the magnetoresistive element, wherein

the insulating layer is provided on the electrode, and the magnetoresistive element is provided on the insulating layer.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0563 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2017
From: SUGIURA, KUNIAKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 042390/0028 →