IP Library Granted Patent US 1,013,663
Granted Patent S1
US 1,013,663 · App. 29/804,312 · Granted Feb 6, 2024

Headphone

Inventors: Pohsun Lee (Shenzhen, CN); Laurent Lindenberger (Shenzhen, CN)
Assignee: Harman International Industries, Incorporated
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Quick Facts
Patent No.
US 1,013,663
App. No.
29/804,312
Granted
Feb 6, 2024
Kind
S1
Claims (1)

The ornamental design for a headphone, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2021
From: LEE, POHSUN; LINDENBERGER, LAURENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
Reel/Frame 057962/0438 →