IP Library › Granted Patent US 1,013,673
Granted Patent S1
US 1,013,673 · App. 29/899,646 · Granted Feb 6, 2024

Set of components for a phone case

Inventor: Jianping Xia (Fuzhou, CN)
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Quick Facts
Patent No.
US 1,013,673
App. No.
29/899,646
Granted
Feb 6, 2024
Kind
S1
Claims (1)

The ornamental design for a set of components for a phone case, as shown and described.