IP Library Granted Patent US 10,180,360
Granted Patent B1
US 10,180,360 · App. 14/987,488 · Granted Jan 15, 2019

Distributed temperature sensor probe

Inventors: Ramon Carlos Naranjo (Reno, NV); Robert Turcotte (Mont-St-Hilaire, CA)
Assignee: The United States of America as Represented by the Secretary of the Department of the Interior
G01K1/08
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Quick Facts
Patent No.
US 10,180,360
App. No.
14/987,488
Granted
Jan 15, 2019
Kind
B1
Abstract

A distributed temperature sensor probe for measuring temperature at multiple depths. The probe includes a plurality of temperature sensors connected in series inside a sensor housing. The temperature sensors are distributed at various points along the length of the sensor housing. Each temperature sensor has an internal storage and an internal battery. A probe head is connected to a top of the sensor housing, and a probe tip is connected to a bottom of the sensor housing.

Claims (19)

1. A distributed temperature sensor probe for measuring temperature at multiple depths, comprising: a sensor housing; a plurality of temperature sensors connected in series inside the sensor housing, the temperature sensors distributed at various points along a length of the sensor housing, and each temperature sensor having an internal storage and an internal battery configured to provide continuous data collection up to time of data retrieval; a printed circuit board inside the sensor housing that connects the temperature sensors together a probe head connected to a top of the sensor housing and said board; and a probe tip connected to a bottom of the sensor housing; wherein said sensors are mounted on said board.

2. The probe of claim 1 , further comprising foam baffles located within the sensor housing between adjacent temperature sensors for thermal isolation of each temperature sensor.

3. The probe of claim 1 , further comprising a communication cable attached to the Probe head.

4. The probe of claim 3 , further comprising the printed circuit board having chip holders that allow the sensors to be snapped into place.

5. The probe of claim 1 , wherein the probe head and the probe tip are connected to the sensor housing forming a water proof housing.

6. The probe of claim 5 , wherein the sensor housing, the probe tip and probe head comprises polyvinyl chloride.

7. The probe of claim 6 configured with sufficient strength and thickness to be capable of being hammered into gravel and cobble bed.

8. The probe of claim 1 , configured to be submerged for a period of days or years while being deployed at a monitoring site.

9. The probe of claim 1 further comprising a thermal transfer compound or paste formed over each said sensor.

10. The probe of claim 1 further including probe head configured to send and to receive data.

11. The probe of claim 10 , capable of retrieving and sending data without removal of the probe from a monitoring site.

12. The probe of claim 1 , further comprising a means for cableless data retrieval.

13. The probe of claim 12 , further comprising the printed circuit board having chip holders that allow the sensors to be snapped into place.

14. A distributed temperature sensor probe for measuring temperature at multiple depths, comprising:

a sensor housing;

a plurality of temperature sensors connected in series inside the sensor housing, the temperature sensors distributed at various points along a length of the sensor housing, and each temperature sensor having an internal storage and an internal battery;

a probe head connected to a top of the sensor housing; and

a probe tip connected to a bottom of the sensor housing; foam baffles located within the sensor housing between adjacent temperature sensors for thermal isolation of each temperature sensor; whereby thermal transfer material is on said sensor between the foam baffles.

15. A distributed temperature sensor probe for measuring temperature at multiple depths, comprising: a sensor housing; a plurality of temperature sensors connected in series inside the sensor housing, the temperature sensors distributed at various points along a length of the sensor housing and each temperature sensor having an internal storage and an internal battery; a printed circuit board inside the sensor housing that connects the temperature sensor together; a probe head connected to a top of the sensor housing and a probe tip connected to a bottom of the sensor housing forming water proof probe; whereby the probe retrieves data and sends data for analysis without being removed from monitoring site; wherein said probe head is connected to said board; wherein said sensors are mounted on said board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2016
From: NARANJO, RAMON CARLOS
To: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE DEPARTMENT OF THE INTERIOR
Reel/Frame 038072/0352 →
Continuity (1)
Provisional Application 62100365 · Jan 6, 2015
Cited By (3)
US 12,320,736 US 12,510,385 US 12,571,750