IP Library › Granted Patent US 1,022,932
Granted Patent S1
US 1,022,932 · App. 29/807,561 · Granted Apr 16, 2024

Semiconductor module

Inventor: Yoshihisa Tsukamoto (Kyoto, JP)
Assignee: ROHM CO., LTD.
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Quick Facts
Patent No.
US 1,022,932
App. No.
29/807,561
Granted
Apr 16, 2024
Kind
S1
Claims (1)

The ornamental design for a semiconductor module, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2021
From: TSUKAMOTO, YOSHIHISA
To: ROHM CO., LTD.
Reel/Frame 057476/0813 →
Priority Claims (2)
JP 2021-005344 D · Mar 16, 2021 · national
JP 2021-005348 D · Mar 16, 2021 · national