IP Library › Granted Patent US 1,024,062
Granted Patent S1
US 1,024,062 · App. 29/796,507 · Granted Apr 23, 2024

Electronic module housing

Inventors: Timothy Alan Suda (Avon, IN); Tobias Merten (Düsseldorf, DE)
Assignee: Aptiv Technologies AG
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Quick Facts
Patent No.
US 1,024,062
App. No.
29/796,507
Filed
Jun 24, 2021
Granted
Apr 23, 2024
Kind
S1
Art Unit
2918
USPC
D14/356
Claims (1)

We claim the ornamental design for an electronic module housing, as shown and described.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2024
From: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
To: APTIV TECHNOLOGIES AG
Reel/Frame 066551/0219 →
ENTITY CONVERSION Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES LIMITED
To: APTIV TECHNOLOGIES (2) S.À R.L.
Reel/Frame 066746/0001 →
MERGER Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES (2) S.À R.L.
To: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
Reel/Frame 066566/0173 →
CORRECTIVE ASSIGNMENT TO CORRECT THE LAST INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 056661 FRAME: 0904. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 23, 2023
From: SUDA, TIMOTHY ALAN; MERTEN, TOBIAS
To: APTIV TECHNOLOGIES LIMITED
Reel/Frame 064688/0799 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2021
From: SUDA, TIMOTHY ALAN; RICHTER-BROCKMANN, TOBIAS
To: APTIV TECHNOLOGIES LIMITED
Reel/Frame 056661/0904 →