IP Library Granted Patent US 10,274,821
Granted Patent B2
US 10,274,821 · App. 15/449,853 · Granted Apr 30, 2019

Mask and manufacturing method of mask

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Quick Facts
Patent No.
US 10,274,821
App. No.
15/449,853
Granted
Apr 30, 2019
Kind
B2
Abstract

A mask includes a plurality of line patterns provided on a substrate, the plurality of line patterns each including a line comprising a plurality of first layers and a plurality of second layers alternately stacked on the substrate. The lines of the plurality of line patterns extend in a first direction and the lines of the plurality of line patterns are spaced in a second direction crossing the first direction. A line of one of the plurality of line patterns has a first portion and a second portion on a side of the first portion in the first direction, the first portion wider than the second portion in the second direction.

Claims (15)

1. A mask comprising:

a plurality of line patterns provided on a substrate, the plurality of line patterns each including a line comprising a plurality of first layers and a plurality of second layers alternately stacked on the substrate, wherein

the lines of the plurality of line patterns extend in a first direction and the lines of the plurality of line patterns are spaced in a second direction crossing the first direction; and

a line of one of the plurality of line patterns has a first portion and a second portion on a side of the first portion in the first direction, the first portion wider than the second portion in the second direction.

2. The mask according to claim 1 , wherein a first height of a first surface above the substrate in the first portion is different from a second height of a second surface above the substrate in the second portion.

3. The mask according to claim 2 , wherein the first height is higher than the second height.

4. The mask according to claim 1 , wherein a part of the first portion has a different height above the substrate than another part of the first portion.

5. The mask according to claim 1 , wherein a distance between the first portion of the line and an adjacent line is 0.1 times to 0.8 times the distance between the second portion of the line and the adjacent line.

6. The mask according to claim 1 , wherein the first layers include molybdenum and the second layers include silicon.

7. The mask according to claim 1 , wherein the first portion includes a particle located between:

one of the first and second layers and the substrate, or

one of the first layers and one of the second layers.

8. The mask according to claim 1 , wherein the first portion includes a particle on the substrate.

9. The mask according to claim 1 , wherein each line of the plurality of line patterns further comprise a third layer; and the first and second layers are provided between the third layer and the substrate.

10. The mask according to claim 9 , wherein the third layer includes ruthenium.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2017
From: MORISHITA, KEIKO; KANAMITSU, SHINGO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 042278/0525 →