IP Library Granted Patent US 1,027,900
Granted Patent S1
US 1,027,900 · App. 29/848,620 · Granted May 21, 2024

Bone conduction headphones

Inventors: Jun Ma (Shenzhen, CN); Huixian Tian (Shenzhen, CN); Hui Pan (Shenzhen, CN); Liu Meng (Shenzhen, CN)
Assignee: U-LOVELIFE (SHENZHEN) TECHNOLOGY CO., LTD
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Quick Facts
Patent No.
US 1,027,900
App. No.
29/848,620
Granted
May 21, 2024
Kind
S1
Claims (1)

The ornamental design for a bone conduction headphones, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2022
From: MA, JUN; TIAN, HUIXIAN; PAN, HUI; MENG, LIU
To: U-LOVELIFE (SHENZHEN) TECHNOLOGY CO., LTD
Reel/Frame 061070/0739 →
Priority Claims (1)
CN 202230157900.2 · Mar 24, 2022 · national