IP Library Granted Patent US 10,324,880
Granted Patent B1
US 10,324,880 · App. 15/386,651 · Granted Jun 18, 2019

Fabric management system and method

Inventors: Daniel Dufresne (Salem, NH); Matthew Mullins (Upton, MA); Antonio Fontes (Northbridge, MA); Patrick J. Weiler (Northborough, MA)
Assignee: EMC IP Holding Company LLC
G06F13/4022G06F13/4068G06F13/4282G06F2213/0026
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Quick Facts
Patent No.
US 10,324,880
App. No.
15/386,651
Granted
Jun 18, 2019
Kind
B1
Abstract

A PCIe fabric is configured to couple a plurality of elements. The PCIe fabric includes a plurality of PCIe subfabrics. A primary master central processing system is configured to couple the plurality of PCIe subfabrics and includes a primary master central processing unit.

Claims (52)

1. A Peripheral Component Interconnect Express (PCIe) fabric configured to couple a plurality of elements, the PCIe fabric comprising:

a plurality of PCIe subfabrics each comprising a managing central processing unit; and

a primary master central processing system configured to couple the plurality of PCIe subfabrics and including a primary master central processing unit, wherein the primary master central processing system is configured to:

determine the topology of the plurality of PCIe subfabrics, wherein determining the topology of the plurality of PCIe subfabrics includes: determining a number of managing central processing units included within the PCIe fabric, and determining the types of elements coupled with the PCIe fabric,

determine the topology of the entire PCIe fabric based upon, at least in part, the topology of the plurality of PCIe subfabrics, and share the topology of the entire PCIe fabric with each of the plurality of PCI subfabrics.

2. The PCIe fabric of claim 1 wherein the primary master central processing system includes:

a primary fan-out switch configured to electrically couple the primary master central processing unit and the plurality of PCIe subfabrics.

3. The PCIe fabric of claim 1 further comprising:

a secondary master central processing system configured to couple the plurality of PCIe subfabrics and including a secondary master central processing unit.

4. The PCIe fabric of claim 3 wherein the secondary master central processing system includes:

a secondary fan-out switch configured to electrically couple the secondary master central processing unit and the plurality of PCIe subfabrics.

5. The PCIe fabric of claim 1 wherein each of the plurality of PCIe subfabrics includes further comprise:

a managing central processing unit, and a PCIe fabric switch.

6. The PCIe fabric of claim 5 further comprising:

one or more communication paths configured to allow communication between the PCIe fabric switch included within each of the plurality of PCIe subfabrics.

7. The PCIe fabric of claim 1 wherein the plurality of elements include components of a data storage system.

8. The PCIe fabric of claim 1 wherein the plurality of elements includes one or more host elements.

9. The PCIe fabric of claim 8 wherein the one or more host elements include one or more compute modules.

10. The PCIe fabric of claim 1 wherein the plurality of elements includes one or more endpoint elements.

11. The PCIe fabric of claim 10 wherein the one or more endpoint elements include one or more of:

one or more host bus adaptors;

Serial Attached Small Computer System Interface (SAS) controllers;

SAS hard disk drives;

fiber channel adapters;

Ethernet adapters;

PCIe flash memory devices;

one or more InfiniBand (IB) adapters;

one or more Redundant Array of Independent Disks (RAID) adapters;

one or more network adapters; and

one or more general purpose graphics processing units.

12. A Peripheral Component Interconnect Express (PCIe) fabric configured to couple a plurality of elements, the PCIe fabric comprising:

a plurality of PCIe subfabrics; and

a primary master central processing system configured to couple the plurality of PCIe subfabrics and including a primary master central processing unit and a primary fan-out switch configured to electrically couple the primary master central processing unit and the plurality of PCIe subfabrics;

wherein each of the plurality of PCIe subfabrics includes: a managing central processing unit, and a PCIe fabric switch; and

wherein the primary master central processing system is configured to: determine the topology of the plurality of PCIe subfabrics, wherein determining the topology of the plurality of PCIe subfabrics includes:

determining a number of managing central processing units included within the PCIe fabric, and

determining the types of elements coupled with the PCIe fabric,

determine the topology of the entire PCIe fabric based upon, at least in part, the topology of the plurality of PCIe subfabrics, and share the topology of the entire PCIe fabric with each managing central processing unit of the plurality of PCI subfabrics.

13. The PCIe fabric of claim 12 further comprising:

one or more communication paths configured to allow communication between the PCIe fabric switch included within each of the plurality of PCIe subfabrics.

14. The PCIe fabric of claim 12 further comprising:

a secondary master central processing system configured to couple the plurality of PCIe subfabrics and including a secondary master central processing unit.

15. The PCIe fabric of claim 14 wherein the secondary master central processing system includes:

a secondary fan-out switch configured to electrically couple the secondary master central processing unit and the plurality of PCIe subfabrics.

16. A Peripheral Component Interconnect Express (PCIe) fabric configured to couple a plurality of elements, the PCIe fabric comprising:

a plurality of PCIe subfabrics;

a primary master central processing system configured to couple the plurality of PCIe subfabrics and including a primary master central processing unit and a primary fan-out switch configured to electrically couple the primary master central processing unit and the plurality of PCIe subfabrics, wherein the primary master central processing system is configured to: determine the topology of the plurality of PCIe subfabrics, wherein determining the topology of the plurality of PCIe subfabrics includes: determining a number of managing central processing units included within the PCIe fabric, and determining the types of elements coupled with the PCIe fabric,

determine the topology of the entire PCIe fabric based upon, at least in part, the topology of the plurality of PCIe subfabrics, and share the topology of the entire PCIe fabric with each of the plurality of PCI subfabrics;

a secondary master central processing system configured to couple the plurality of PCIe subfabrics and including a secondary master central processing unit and a secondary fan-out switch configured to electrically couple the secondary master central processing unit and the plurality of PCIe subfabrics; and

one or more communication paths configured to allow communication between the PCIe fabric switch included within each of the plurality of PCIe subfabrics.

17. The PCIe fabric of claim 16 wherein the plurality of elements includes one or more host elements.

18. The PCIe fabric of claim 16 wherein the plurality of elements includes one or more endpoint elements.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2016
From: DUFRESNE, DANIEL; MULLINS, MATTHEW; FONTES, ANTONIO; WEILER, PATRICK J.
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 041128/0851 →
Continuity (1)
Continuation In Part 15273177 · Sep 22, 2016