Electronic component and electronic component manufacturing method

1. An electronic component comprising:

a first substrate that comprises a first substrate surface;

a second substrate that is arranged on the first substrate and has a thermal expansion coefficient different from a thermal expansion coefficient of the first substrate;

a connecting member that connects the first substrate and a peripheral edge portion of the second substrate; and

a third substrate that is mounted on a surface of the second substrate except for the peripheral edge portion,

wherein the third substrate has a surface on which an electronic device is mounted,

wherein the third substrate, has a thermal expansion coefficient different from the thermal expansion coefficient of the second substrate,

wherein the thermal expansion coefficient of the second substrate is between the thermal expansion coefficient of the third substrate and the thermal expansion coefficient of the first substrate, and

wherein the second substrate is fixed to the first substrate by the connecting member.

2. The electronic component according to claim 1 ,

wherein the first substrate surface of the first substrate comprises an opening portion, and

at least a portion of the second substrate is accommodated in the opening portion.

3. The electronic component according to claim 2 , further comprising:

a support member that is arranged opposing the second substrate, the support member supporting the second substrate from a side of a second substrate surface of the first substrate in a thickness direction of the first substrate, the second substrate surface being on an opposite side of the first substrate surface.

4. The electronic component according to claim 2 , wherein the first substrate surface is approximately coplanar with a substrate surface of the peripheral edge portion of the second substrate.

5. The electronic component according to claim 1 , wherein the connecting member has lower rigidity than the first substrate and the second substrate and is capable of deforming in response to relative movement of the first substrate and the second substrate.

6. The electronic component according to claim 1 ,

wherein the first substrate comprises a first electrode arranged on a region of the first substrate surface, the region not overlapping with the second substrate when seen in a thickness direction of the first substrate,

the second substrate comprises a second electrode arranged on a substrate surface of the second substrate,

the connecting member comprises an electrically conductive pattern, the connecting member opposing the first electrode and the second electrode, and the connecting member straddling the first substrate and the second substrate, and

the electrically conductive pattern is joined electrically with the first electrode and the second electrode by a joining member.

7. The electronic component according to claim 6 , wherein a data signal is transmitted to a circuit formed by the electrically conductive pattern of the connecting member, the first electrode, and the second electrode.

8. The electronic component according to claim 1 , wherein the second substrate comprises a third electrode that is not joined with the connecting member, and a power supply line is connected to the third electrode.

9. The electronic component according to claim 1 ,

wherein the connecting member comprises a plurality of the connecting members, and

wherein the first substrate and the second substrate are mutually connected by the plurality of the connecting members.

10. The electronic component according to claim 9 , wherein the plurality of the connecting members are symmetrically arranged centered on the second substrate.

11. An electronic component manufacturing method comprising:

mounting a third substrate on a region of a surface of a second substrate except for a peripheral edge portion of the second substrate, the third substrate having a surface on which an electronic device is mounted, and the third substrate having a thermal expansion coefficient different from a thermal expansion coefficient of the second substrate;

arranging the second substrate on a first substrate, the first substrate having a thermal expansion coefficient different from the thermal expansion coefficient of the second substrate;

arranging a connecting member in a state of straddling the first substrate and the peripheral edge portion of the second substrate; and

fixing the first substrate and the peripheral edge portion of the second substrate by the connecting member,

wherein the thermal expansion coefficient of the second substrate is between the thermal expansion coefficient of the third substrate and the thermal expansion coefficient of the first substrate.

12. The electronic component according to claim 1 ,

wherein a thermal expansion coefficient of the connection member is between the thermal expansion coefficient of the first substrate and the thermal expansion coefficient of the second substrate,

wherein the thermal expansion coefficient of the connection member has a value closer to an average value than either the thermal expansion coefficient of the first substrate or the thermal expansion coefficient of the second substrate, and

wherein the average value is an average value of the thermal expansion coefficient of the first substrate and the thermal expansion coefficient of the second substrate.