Method for producing electrical connections
Systems and methods are provided to produce electromechanical interconnections within integrated circuits (ICs), printed circuit boards (PCBs) and between PCBs and other electronic components such as resistors, capacitors and integrated circuits. Elements include so-called “smart pins” or “neuro-pins” that facilitate electrical pathways in the dimension normal to the plane of a PCB. Smart pins or neuro-pins may be inserted using automated processes that do not require the high temperatures normally associated with soldering. Resultant circuits generally contain a large number of layers that are more compact and more readily constructed compared with conventional PCB-based circuitry.
1. A method for producing electrical connections, comprising:
manufacturing a pin to insert into a hole that traverses one or more layers of electrical circuits,
wherein the hole is lined by one or more electrical contacts in electrical continuity with at least one of the electrical circuits;
wherein the pin comprises an insulating material and one or more electrically conductive pathways; and
inserting the pin into the hole to produce electrical connections between the one or more electrical contacts lining the hole and the one or more electrically conductive pathways on the pin,
wherein the insulating material is mechanically compressed prior to insertion, allowing expansion after insertion, and
wherein the connection of the one or more electrical connections is produced due to expansion of the insulating material.
2. The method of claim 1 , wherein the pin mechanically locks within the hole due to expansion of the insulating material.
3. The method of claim 1 , where the pin and corresponding hole are one of round, square, triangular, rectangular, planar, pentagonal, hexagonal, heptagonal, octagonal and an N-sided polygon where N is greater than 3.
4. The method of claim 1 , where the insulating material is one of an elastomer, polymer, polyvinyl chloride, plastic and rubber.
5. The method of claim 1 , where the insulating material includes a plasticizer additive that is one of esters, polyvinyl chloride, phthalate ester, sebacates, adipates, terephthalates, dibenzoates, gluterates, phthalates and azelates.
6. The method of claim 1 , where the insulating material includes a foaming agent that expands following insertion.
7. The method of claim 6 , where the foaming agent is one of plastic, polyvinyl chloride, or polymer.
8. The method of claim 1 , where the electrically conductive pathways are metallic wires.
9. The method of claim 8 , where the wires are one of substantially round, ellipsoid, T-shaped and in the shape of a ribbon.
10. The method of claim 1 , where the electrically conductive pathways include metallic nanoparticles.
11. The method of claim 1 , where the electrically conductive pathways are conductive organic polymers.
12. The method of claim 1 , where the one or more layers of electrical circuits include layers within printed circuit boards.
13. The method of claim 1 , where the one or more layers of electrical circuits include layers within electronic components that include one or more of resistors, capacitors, inductors, printed circuit boards, integrated circuits, diodes, or transistors.
14. The method of claim 1 , where electronic contacts are formed by removing the substrate beneath a conductive trace, allowing one or more conductive traces to bend over and line the sides of the resultant hole where substrate was removed.
15. The method of claim 1 , wherein the expansion of insulating material results from exposure to one or more of ultrasound, radio frequency energy, ultraviolet light, infrared light, heat, cooling, pressure, and vibration.
16. The method of claim 2 , wherein the pin mechanically locks within the hole due to expansion of material within conductive pathways.
17. The method of claim 1 , wherein the end of the pin is tapered such that the pin may be inserted into the hole when the pin and hole are not perfectly aligned.
18. The method of claim 1 , where the pin is formed by additive manufacturing.
19. A method for producing electrical connections, comprising:
manufacturing a pin to insert into a hole that traverses one or more layers of electrical circuits,
wherein the hole is lined by one or more electrical contacts in electrical continuity with at least one of the electrical circuits;
wherein the pin comprises an insulating material and one or more electrically conductive Pathways; and
inserting the pin into the hole to produce electrical connections between the one or more electrical contacts lining the hole and the one or more electrically conductive pathways on the pin,
wherein the connection of the one or more electrical connections is produced due to expansion of the insulating material, and
wherein the insulating material is cooled prior to insertion and allowed to warm, causing expansion after insertion.
20. A method for producing electrical connections, comprising:
manufacturing a pin to insert into a hole that traverses one or more layers of electrical circuits,
wherein the hole is lined by one or more electrical contacts in electrical continuity with at least one of the electrical circuits;
wherein the pin comprises an insulating material and one or more electrically conductive pathways; and
inserting the pin into the hole to produce electrical connections between the one or more electrical contacts lining the hole and the one or more electrically conductive pathways on the pin,
wherein the insulating material is heated prior to insertion causing the insulating material to soften, allowing expansion into the hole upon the application of force during insertion and mechanical locking upon hardening when subsequently cooled.