Liquid submersion cooled electronic systems and devices
Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
1. A liquid submersion cooled electronic device, comprising:
a non-pressurized device housing defining an interior space, the non-pressurized device housing including a tray with an at least partially open top and a cover removably attached to the tray and disposed over the at least partially open top;
at least one heat generating electronic component disposed within the interior space of the non-pressurized device housing;
a dielectric cooling liquid in the interior space, the dielectric cooling liquid partially or fully submerging and in direct contact with the at least one heat generating electronic component;
a pump having a pump inlet in fluid communication with the interior space and a pump outlet;
a heat exchanger having a heat exchanger inlet in fluid communication with the pump outlet and having a heat exchanger outlet in fluid communication with the interior space;
a liquid distribution manifold within the interior space, the liquid distribution manifold having a manifold inlet in fluid communication with the heat exchanger outlet, and a plurality of manifold outlets;
a tube having an inlet end thereof connected to one of the manifold outlets, and an outlet end thereof adjacent to the at least one heat generating electronic component to direct a return flow of dielectric cooling liquid to the at least one heat generating electronic component;
an open top tray disposed within the interior space, the at least one heat generating electronic component is disposed within the open top tray, the outlet end of the tube is connected to the open top tray to direct the return flow of dielectric cooling liquid into a space defined by the open top tray, and a side wall of the open top tray includes a dielectric cooling liquid outlet weir from which dielectric cooling liquid exits the space defined by the open top tray.
2. The liquid submersion cooled electronic device of claim 1 , wherein the pump is disposed within the interior space and the pump inlet is submerged in the dielectric cooling liquid.
3. The liquid submersion cooled electronic device of claim 1 , wherein the heat exchanger is disposed within the interior space.
4. The liquid submersion cooled electronic device of claim 1 , wherein the heat exchanger is disposed outside of the non-pressurized device housing.
5. The liquid submersion cooled electronic device of claim 1 , wherein the pump and the heat exchanger are disposed at a first end of the non-pressurized device housing, and the liquid distribution manifold is disposed at a second end of the non-pressurized device housing opposite to the first end.
6. The liquid submersion cooled electronic device of claim 1 , further comprising an air vent or pressure relief/equalization mechanism in the cover which provides air communication between the interior space and ambient environment.
7. The liquid submersion cooled electronic device of claim 1 , wherein the least one heat generating electronic component comprises a plurality of heat generating electronic components within the interior space, and wherein the plurality of heat generating electronic components comprise a plurality of data storage devices, a plurality of power supplies, a plurality of processors, or a plurality of switches.
8. A liquid submersion cooled electronic system, comprising:
a plurality of liquid submersion cooled electronic devices of claim 1 disposed in a vertical array on a rack.
9. A liquid submersion cooled electronic device, comprising:
a device housing defining an interior space, the device housing including a tray with an at least partially open top and a cover removably attached to the tray and disposed over the at least partially open top;
an air vent or pressure relief/equalization mechanism in the cover which provides air communication between the interior space and ambient environment;
at least one heat generating electronic component disposed within the interior space of the device housing;
a dielectric cooling liquid in the interior space, the dielectric cooling liquid partially or fully submerging and in direct contact with the at least one heat generating electronic component;
a pump having a pump inlet in fluid communication with the interior space and a pump outlet;
a heat exchanger having a heat exchanger inlet in fluid communication with the pump outlet, and a heat exchanger outlet in fluid communication with the interior space;
a liquid distribution manifold within the interior space, the liquid distribution manifold having a manifold inlet in fluid communication with the heat exchanger outlet, and a plurality of manifold outlets;
a tube having an inlet end thereof connected to one of the manifold outlets, and an outlet end thereof adjacent to the at least one heat generating electronic component to direct a return flow of dielectric cooling liquid to the at least one heat generating electronic component; and
an open top tray disposed within the interior space, the at least one heat generating electronic component is disposed within the open top tray, the outlet end of the tube is connected to the open top tray to direct the return flow of dielectric cooling liquid into a space defined by the open top tray, and a side wall of the open top tray includes a dielectric cooling liquid outlet weir from which dielectric cooling liquid exits the space defined by the open top tray.
10. The liquid submersion cooled electronic device of claim 9 , wherein the pump is disposed within the interior space and the pump inlet is submerged in the dielectric cooling liquid.
11. The liquid submersion cooled electronic device of claim 9 , wherein the heat exchanger is disposed within the interior space.
12. The liquid submersion cooled electronic device of claim 9 , wherein the heat exchanger is disposed outside of the device housing.
13. The liquid submersion cooled electronic device of claim 9 , wherein the pump and the heat exchanger are disposed at a first end of the device housing, and the liquid distribution manifold is disposed at a second end of the device housing opposite to the first end.
14. The liquid submersion cooled electronic device of claim 9 , wherein the least one heat generating electronic component comprises a plurality of heat generating electronic components within the interior space, and wherein the plurality of heat generating electronic components comprise a plurality of data storage devices, a plurality of power supplies, a plurality of processors, or a plurality of switches.
15. A liquid submersion cooled electronic system, comprising:
a plurality of liquid submersion cooled electronic devices of claim 9 disposed in a vertical array on a rack.