Apparatus for flipping semiconductor device
An apparatus for transferring a semiconductor device comprises platform comprising a carrier; a positioning unit above the platform and comprising an opening; and an elevating unit connecting the platform and the positioning unit; and a heater.
1. An apparatus for transferring a semiconductor device, comprising:
a platform comprising a carrier;
a positioning unit arranged above the platform and comprising an opening; and
an elevating unit connecting the platform and the positioning unit; and
a heater arranged above the positioning unit.
2. The apparatus for transferring a semiconductor device according to claim 1 , further comprising a roller system, wherein the roller system comprises a roller and a track, the roller is configured to move along the track.
3. The apparatus for transferring a semiconductor device according to claim 2 , wherein the roller comprises a non rigid body or an elastic material.
4. The apparatus for transferring a semiconductor device according to claim 2 , wherein the roller has a shape of a cylinder or a barrel-shaped cylinder with two extending cylinder ends.
5. The apparatus for transferring a semiconductor device according to claim 2 , wherein the roller is configured to roll at a constant speed, variable speed, or a constant acceleration.
6. The apparatus for transferring a semiconductor device according to claim 2 , wherein the roller is capable of rolling and exerting a downward pressure.
7. The apparatus for transferring a semiconductor device according to claim 1 , further comprising a ring fixed at the opening.
8. The apparatus for transferring a semiconductor device according to claim 7 , further comprising an adhesive substance attached to the ring.
9. The apparatus for transferring a semiconductor device according to claim 8 , wherein a stickiness of the adhesive substance changes with a change of temperature.
10. The apparatus for transferring a semiconductor device according to claim 1 , further comprising a fixture on the carrier.
11. The apparatus for transferring a semiconductor device according to claim 10 , further comprising an adhesive substance attached to the fixture.
12. The apparatus for transferring a semiconductor device according to claim 11 , wherein a stickiness of the adhesive substance changes with a change of temperature.
13. The apparatus for transferring a semiconductor device according to claim 1 , wherein the elevating unit comprises a pneumatic cylinder for providing driving force.
14. The apparatus for transferring a semiconductor device according to claim 13 , wherein the pneumatic cylinder is an adjustable uniaxial cylinder.
15. The apparatus for transferring a semiconductor device according to claim 1 , wherein the heater is movable above the positioning unit.
16. The apparatus for transferring a semiconductor device according to claim 2 , wherein the roller comprises a rubber.
17. The apparatus for transferring a semiconductor device according to claim 1 , wherein the positioning unit is configured to move toward or away from the platform.
18. The apparatus for transferring a semiconductor device according to claim 1 , wherein the carrier comprises a heating unit.
19. The apparatus for transferring a semiconductor device according to claim 1 , wherein the opening is circular.
20. The apparatus for transferring a semiconductor device according to claim 1 , wherein the heater is arranged to change its position relative to the positioning unit.