Method for modifying small form factor pluggable transceiver for avionics applications
A method for modifying a low-cost small form factor pluggable optical-electrical bidirectional transceiver (hereinafter “SFP transceiver”) by converting the SFP transceiver into a dual-in-line package. Such conversion enables the SFP transceiver to be soldered directly on a printed circuit board of a line replaceable unit of an avionics system, thereby eliminating the concern that the SFP transceiver may become detached due to vibration during aircraft operation. The method also includes a sealing process to protect the contact pads on the SFP transceiver, thereby eliminating any concern that the contact pads could corrode due to long-term moisture and humidity exposure. The product of the method is a ruggedized SFP transceiver capable of withstanding the rigors of operating in a harsh avionics environment onboard an aircraft.
1. A method for modifying a small form factor pluggable (SFP) transceiver, the method comprising:
removing a cover from the SFP transceiver;
separating a printed circuit board (PCB) of the SFP transceiver from a metal base of the SFP transceiver;
soldering a multiplicity of metal pins to a multiplicity of contact pads on the PCB, the metal pins being held in spaced-apart relationship by a pin holder;
depositing non-conductive moisture sealant on the contact pads after soldering;
forming a feed-through hole in a bottom of the metal base;
seating the PCB on the metal base while also seating the pin holder in the feed-through hole;
placing a different cover over the PCB; and
attaching the different cover to the metal base.
2. The method as recited in claim 1 , wherein the different cover is made of a material that provides protection to the PCB against electromagnetic interference.
3. The method as recited in claim 1 , wherein the multiplicity of metal pins comprises first and second rows of metal pins, and the multiplicity of contact pads comprises first and second rows of contact pads, the first row of metal pins being soldered to the first row of contact pads, and the second row of metal pins being soldered to the second row of contact pads.
4. The method as recited in claim 3 , wherein the first row of contact pads is disposed on a top surface of the PCB and the second row of contact pads is disposed on a bottom surface of the PCB.
5. The method as recited in claim 3 , wherein distal terminations of the multiplicity of metal pins are coplanar.
6. The method as recited in claim 5 , further comprising soldering the distal terminations of the multiplicity of metal pins to a PCB of a line replaceable unit onboard an aircraft.
7. The method as recited in claim 3 , further comprising attaching first and second metal alignment pins to the bottom of the metal base.
8. The method as recited in claim 7 , further comprising soldering distal terminations of the multiplicity of metal pins and distal ends of the first and second metal alignment pins to a PCB of a line replaceable unit onboard an aircraft.
9. A method for modifying a small form factor pluggable (SFP) transceiver, the method comprising:
removing a cover from the SFP transceiver;
separating a printed circuit board (PCB) of the SFP transceiver from a metal base of the SFP transceiver;
soldering a multiplicity of metal pins to a multiplicity of contact pads on the PCB, the metal pins being held in spaced-apart relationship by a pin holder;
forming a feed-through hole in a bottom of the metal base;
seating the PCB on the metal base while also seating the pin holder in the feed-through hole;
placing a different cover over the PCB; and
attaching the different cover to the metal base,
wherein the multiplicity of metal pins comprises first and second rows of metal pins, and the multiplicity of contact pads comprises first and second rows of contact pads, the first row of metal pins being soldered to the first row of contact pads, and the second row of metal pins being soldered to the second row of contact pads.
10. The method as recited in claim 9 , wherein the first row of contact pads is disposed on a top surface of the PCB and the second row of contact pads is disposed on a bottom surface of the PCB.
11. The method as recited in claim 9 , wherein distal terminations of the multiplicity of metal pins are coplanar.
12. The method as recited in claim 11 , further comprising soldering the distal terminations of the multiplicity of metal pins to a PCB of a line replaceable unit onboard an aircraft.
13. The method as recited in claim 9 , further comprising attaching first and second metal alignment pins to the bottom of the metal base.
14. The method as recited in claim 13 , further comprising soldering distal terminations of the multiplicity of metal pins and distal ends of the first and second metal alignment pins to a PCB of a line replaceable unit onboard an aircraft.
15. The method as recited in claim 9 , wherein the different cover is made of a material that provides protection to the PCB against electromagnetic interference.
16. A method for modifying a fully assembled small form factor pluggable (SFP) transceiver that comprises a cover, a printed circuit board (PCB), and a metal base when fully assembled, the method comprising:
(a) separating the cover from the metal base;
(b) separating the PCB from the metal base;
(c) soldering a multiplicity of metal pins to a multiplicity of contact pads on the PCB, the metal pins being held in spaced-apart relationship by a pin holder;
(d) forming a feed-through hole in a bottom of the metal base;
(e) seating the PCB on the metal base while also seating the pin holder in the feed-through hole;
(f) placing a different cover over the PCB; and
(g) attaching the different cover to the metal base,
further comprising soldering distal terminations of the multiplicity of metal pins to a PCB of a line replaceable unit onboard an aircraft.
17. The method as recited in claim 16 , wherein the different cover is made of a material that provides protection to the PCB against electromagnetic interference.
18. The method as recited in claim 16 , further comprising depositing non-conductive moisture sealant on the contact pads after soldering.
19. The method as recited in claim 16 , wherein the multiplicity of metal pins comprises first and second rows of metal pins, and the multiplicity of contact pads comprises first and second rows of contact pads, the first row of metal pins being soldered to the first row of contact pads, and the second row of metal pins being soldered to the second row of contact pads.
20. The method as recited in claim 16 , wherein the first row of contact pads is disposed on a top surface of the PCB and the second row of contact pads is disposed on a bottom surface of the PCB.