IP Library › Granted Patent US 1,082,791
Granted Patent S1
US 1,082,791 · App. 29/876,120 · Granted Jul 8, 2025

Internal module for 3D scanner

Inventors: Wei Liu (Guangdong, CN); Zuanze Lin (Guangdong, CN)
Assignee: ORBBEC INC.
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Quick Facts
Patent No.
US 1,082,791
App. No.
29/876,120
Granted
Jul 8, 2025
Kind
S1
Claims (1)

The ornamental design for an internal module for 3D scanner, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2023
From: LIU, WEI; LIN, ZUANZE
To: ORBBEC INC.
Reel/Frame 063752/0679 →
Priority Claims (1)
CN 202330104814.X · Mar 9, 2023 · national
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