Granted Patent
S1
US 1,090,465 · App. 29/938,184 · Granted Aug 26, 2025
Power module housing
Inventors:
Yuan-Cheng Huang (New Taipei, TW); Ji-Yuan Syu (Kaohsiung, TW); Chun-Kai Liu (Hsinchu, TW)
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
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Claims (1)
The ornamental design for a power module housing, as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded May 2, 2024
From: HUANG, YUAN-CHENG; SYU, JI-YUAN; LIU, CHUN-KAI
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 067298/0438 →
Priority Claims (1)
TW 113301063
· Mar 5, 2024
· national
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