IP Library › Granted Patent US 1,101,656
Granted Patent S1
US 1,101,656 · App. 29/937,787 · Granted Nov 11, 2025

Connector of packaging for foodstuffs

Inventors: Wu-Chou Kuo (Taipei, TW); Yu-Min Lee (New Taipei, TW)
Assignee: BOTRISTA, INC.
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Quick Facts
Patent No.
US 1,101,656
App. No.
29/937,787
Granted
Nov 11, 2025
Kind
S1
Claims (1)

The ornamental design for a connector of packaging for foodstuffs, as shown and described.

Continuity (1)
Division 29827257 · Feb 18, 2022
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