Separation of liquid in droplets and sedimented material enclosed therein
View Patent ↗The invention relates to methods for drawing-off liquid from individual droplets which are in a predefined arrangement on a flat substrate and have sedimented material enclosed in them. A mask of an absorbent material comprising a pattern of indentations or holes which corresponds at least partially to the regular arrangement of the individual droplets, or a stiff, rigid plate of an absorbent material is positioned above the flat substrate in such a way that the droplets come into contact with the absorbent material peripherally so that liquid is drawn off there-into. The invention also relates to a mask of an absorbent material with a substantially rectangular shape which has a predefined pattern of indentations or holes for the purpose of separating liquid and sedimented material enclosed therein.
1. A method for drawing-off liquid from individual droplets which are in a predefined arrangement on a surface of a flat substrate and have sedimented material enclosed in them, the method comprising:
providing a rigid plate of an absorbent material above the flat substrate;
providing a spacer ridge that has a fixed location relative to one of the flat substrate and the rigid plate, and that extends a predetermined distance in a first direction between the substrate and the rigid plate, wherein the spacer ridge is configured to keep the rigid plate at a distance of one-third to one-half of a diameter of a droplet of the individual droplets, above the surface of the flat substrate; and
reducing a relative distance between the rigid plate and the flat substrate along the first direction until the spacer ridge obstructs further relative movement between the rigid plate and the flat substrate and prevents contact between the absorbent material and the flat substrate, while the individual droplets contact the absorbent material; and as a result of such, at least a portion of droplet liquid is drawn off of the flat substrate by the absorbent material.
2. The method according to claim 1 , wherein the flat substrate is located in a flat substrate receptacle which comprises the spacer ridge.
3. The method according to claim 1 , wherein the spacer ridge is fixed to a surface of the rigid plate.