Assembly with at least one antenna and a thermal insulation component

1. An assembly comprising:

at least one antenna,

wherein the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

wherein the thermal insulation component comprises:

a thermal insulation layer;

a protective film, wherein the protective film comprises:

a polymer layer; and

a first adhesive layer, wherein the first adhesive layer is disposed between the thermal insulation layer and the polymer layer; and

a second adhesive layer;

wherein the thermal insulation layer is disposed between the protective film and the second adhesive layer; and

wherein the second adhesive layer is disposed between the thermal insulation layer and the at least one antenna;

wherein the thermal insulation component is disposed within the field of RF communication, and

wherein the thermal insulation component has a thermal conductivity of 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.

2. The assembly of claim 1 , wherein the thermal insulation component has a thickness of 0.03 mm to 2 mm.

3. The assembly of claim 1 , wherein the thermal insulation component comprises an aerogel.

4. The assembly of claim 3 , wherein the thermal insulation component comprises the aerogel in an amount of at least 30 wt % based on a total weight of the thermal insulation component.

5. The assembly of claim 4 , wherein the thermal insulation component comprises the aerogel in an amount of 30 wt % to 95 wt % based on a total weight of the thermal insulation component.

6. The assembly of claim 3 , wherein the thermal insulation component further comprises polytetrafluoroethylene (PTFE).

7. The assembly of claim 6 , wherein the aerogel is a PTFE reinforced aerogel.

8. The assembly of claim 7 , wherein the PTFE reinforced aerogel is a PTFE reinforced aerogel in a clad configuration, wherein the clad configuration comprises a plurality of ePTFE layers, wherein each of the plurality of ePTFE layers is bonded to a surface of the thermal insulation layer.

9. The assembly of claim 1 , wherein the thermal insulation component comprises a plurality of thermal insulation layers.

10. The assembly of claim 1 , wherein the at least one antenna is in the form of an antenna array, wherein the antenna array comprises a plurality of antennas, wherein each antenna is configured to transmit the field of RF communication at the operating frequency ranging from 6 GHz to 100 GHz.

11. The assembly of claim 10 , wherein the thermal insulation component is embedded within the antenna array.

12. The assembly of claim 1 , wherein the thermal insulation component has a dielectric constant ranging from 1.05 to 4 measured in accordance with IEC 61189-2-721 Edition 12015-04 at 10 GHz using a Split Post Dielectric Resonator (SPDR).

13. The assembly of claim 1 , wherein the thermal insulation has a loss tangent ranging from 0.00001 to 0.1 measured in accordance with IEC 61189-2-721 Edition 12015-04 at 10 GHz using a Split Post Dielectric Resonator (SPDR).

14. The assembly of claim 1 , wherein the assembly is within an enclosure of a device.

15. The assembly of claim 1 , wherein a portion of the thermal insulation component extends beyond the field of RF communication.

16. The assembly of claim 1 , wherein the assembly further comprises a power amplifier.

17. The assembly of claim 1 , wherein the assembly has an operating temperature ranging from 20° C. to 120° C., wherein the operating temperature is measured at an interface between the thermal insulation component and the at least one antenna.

18. An assembly comprising:

at least one antenna,

wherein the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

wherein the thermal insulation component comprises:

a thermal insulation layer;

a protective film, wherein the protective film comprises:

a polymer layer; and

a first adhesive layer, wherein the first adhesive layer is disposed between the thermal insulation layer and the polymer layer; and

a second adhesive layer

wherein the thermal insulation layer is disposed between the protective film and the second adhesive layer; and

wherein the second adhesive layer is disposed between the thermal insulation layer and the at least one antenna;

wherein the thermal insulation component is disposed within the field of RF communication, and

wherein the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm,

wherein the thermal insulation component has a has a dielectric constant ranging from 1.05 to 4 measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a Split Post Dielectric Resonator (SPDR), and

wherein the thermal insulation component has a loss tangent ranging from 0.00001 to 0.1 measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using the SPDR.

19. An assembly comprising:

at least one antenna,

wherein the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

wherein the thermal insulation component comprises:

a thermal insulation layer;

a protective film, wherein the protective film comprises:

a polymer layer; and

a first adhesive layer, wherein the first adhesive layer is disposed between the thermal insulation layer and the polymer layer; and

a second adhesive layer;

wherein the thermal insulation layer is disposed between the protective film and the second adhesive layer; and

wherein the second adhesive layer is disposed between the thermal insulation layer and the at least one antenna;

wherein the thermal insulation component is disposed within the field of RF communication,

wherein the thermal insulation component has a thickness of 0.03 mm to 2 mm, and

wherein the thermal insulation component comprises an aerogel in an amount of 30 wt % to 95 wt % based on a total weight of the thermal insulation component.

20. The assembly of claim 19 , wherein the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.

21. An assembly comprising:

an antenna array,

wherein the antenna array is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component,

wherein the thermal insulation component is disposed within the field of RF communication, and wherein the thermal insulation component comprises:

a thermal insulation layer;

wherein the thermal insulation layer defines 50% to 99% of a total thickness of the thermal insulation component;

a protective film, wherein the protective film comprises:

a polymer layer; and

a first adhesive layer, wherein the first adhesive layer is disposed between the thermal insulation layer and the polymer layer; and

a second adhesive layer,

wherein the thermal insulation layer is disposed between the protective film and the second adhesive layer; and

wherein the second adhesive layer is disposed between the antenna array and the thermal insulation layer.

22. The assembly of claim 21 , wherein the at least one thermal insulation layer has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.