IP Library › Granted Patent US 1,115,069
Granted Patent S1
US 1,115,069 · App. 29/962,075 · Granted Feb 24, 2026

Modular high-capacity beam

Inventor: Bradley D. A. Bond (Katy, TX)
Assignee: Bond Formwork Systems, LLC
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Quick Facts
Patent No.
US 1,115,069
App. No.
29/962,075
Granted
Feb 24, 2026
Kind
S1
Claims (1)

The ornamental design for a modular high-capacity beam as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2026
From: BOND FORMWORK SYSTEMS, LLC
To: WHITE CAP, L.P.
Reel/Frame 074795/0075 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2026
From: BOND, BRADLEY D.A.
To: BOND FORMWORK SYSTEMS, LLC
Reel/Frame 075214/0931 →
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