IP Library › Granted Patent US 1,128,615
Granted Patent S1
US 1,128,615 · App. 29/970,948 · Granted Jun 2, 2026

Carrier substrate for handling

Inventors: Yoshinori Ogawa (Kamakura, JP); Kazunori Kondo (Takasaki, JP); Nobuaki Tomura (Sendai, JP); Nobuaki Matsumoto (Takasaki, JP); Akira Sakamoto (Takasaki, JP); Taichi Kitagawa (Annaka, JP)
Assignee: SHIN-ETSU CHEMICAL CO., LTD.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 1,128,615
App. No.
29/970,948
Granted
Jun 2, 2026
Kind
S1
Claims (1)

The ornamental design for a carrier substrate for handling as shown and described.

Priority Claims (5)
JP 2021-022497 D · Oct 15, 2021 · national
JP 2021-22498 D · Oct 15, 2021 · national
JP 2021-22499 D · Oct 15, 2021 · national
JP 2021-022501 D · Oct 15, 2021 · national
JP 2021-22502 D · Oct 15, 2021 · national
Continuity (1)
Continuation 29835098 · Apr 15, 2022
References Cited (73)
US 6815352B1 · Tamura et al. · 2004 [cited by applicant]
US D544452S · Nakamura et al. · 2007 [cited by applicant]
US D552565S · Nakamura et al. · 2007 [cited by applicant]
US D559805S · Hosaka · 2008 [cited by applicant]
US D583394S · Ota · 2008 [cited by applicant]
US D589474S · Ogasawara et al. · 2009 [cited by applicant]
US D589912S · Ogasawara et al. · 2009 [cited by applicant]
US D609652S · Nagasaka et al. · 2010 [cited by applicant]
US D614593S · Lee et al. · 2010 [cited by applicant]
US 7943491B2 · Nuzzo et al. · 2011 [cited by applicant]
US D654883S · Honma et al. · 2012 [cited by applicant]
US D654884S · Honma et al. · 2012 [cited by applicant]
US D674759S · Chang et al. · 2013 [cited by applicant]
US 8389320B2 · Kannou et al. · 2013 [cited by applicant]
US D684551S · Nguyen · 2013 [cited by applicant]
US 8551864B2 · Hatsukawa · 2013 [cited by applicant]
US 8555492B2 · Wang et al. · 2013 [cited by applicant]
US 8690135B2 · Vekstein et al. · 2014 [cited by applicant]
US D704155S · Chang et al. · 2014 [cited by applicant]
US D708651S · Martin et al. · 2014 [cited by applicant]
US D716742S · Jang et al. · 2014 [cited by applicant]
US D720313S · Flynn et al. · 2014 [cited by applicant]
US D723077S · Sakata · 2015 [cited by applicant]
US D724553S · Choi et al. · 2015 [cited by applicant]
US D753269S · Yamagishi et al. · 2016 [cited by applicant]
US D789888S · Jang et al. · 2017 [cited by applicant]
US D793971S · Krishnan et al. · 2017 [cited by applicant]
US D797067S · Zhang et al. · 2017 [cited by applicant]
US D809804S · Tai · 2018 [cited by examiner]
US D830981S · Jeong et al. · 2018 [cited by applicant]
US D849422S · Tai et al. · 2019 [cited by applicant]
US D873782S · Garcia · 2020 [cited by examiner]
US D908645S · Savandaiah et al. · 2021 [cited by applicant]
US D924823S · Saiki et al. · 2021 [cited by applicant]
US D937329S · Riker et al. · 2021 [cited by applicant]
US D947802S · Sakata et al. · 2022 [cited by applicant]
US D958094S · Jo et al. · 2022 [cited by applicant]
US D966276S · Jo et al. · 2022 [cited by applicant]
US D981970S · Inada et al. · 2023 [cited by applicant]
US D981972S · Morita et al. · 2023 [cited by applicant]
US 11629407B2 · Pierreux et al. · 2023 [cited by applicant]
US D984972S · Shi · 2023 [cited by applicant]
US 11664267B2 · Roh et al. · 2023 [cited by applicant]
US D1030687S · Huang · 2024 [cited by examiner]
US D1053230S · Hoi · 2024 [cited by examiner]
US D1054388S · Ogawa · 2024 [cited by examiner]
US D1067204S · Huang · 2025 [cited by examiner]
US 20040149567A1 · Kosyachkov · 2004 [cited by examiner]
US 20050152089A1 · Matsuda · 2005 [cited by examiner]
US 20050193952A1 · Goodman · 2005 [cited by examiner]
US 20100108500A1 · Hawrylchak et al. · 2010 [cited by applicant]
US 20100244631A1 · Kobayashi · 2010 [cited by examiner]
US 20220124949A1 · Nakagawa et al. · 2022 [cited by applicant]
JP 2006310616A · 2006 [cited by applicant]
JP 2008227107A · 2008 [cited by applicant]
JP 2020129638A · 2020 [cited by applicant]
TW D178145S · 2016 [cited by applicant]
TW I689017B · 2020 [cited by applicant]
TW D208179S · 2020 [cited by applicant]
WO 2020166184A1 · 2020 [cited by applicant]
Wafer Carrier Trays,https://www.tedpella.com/storage-boxes-bags_html/wafer-carrier-trays.aspx, 2023. (Year: 2023). [cited by examiner]
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793. [cited by applicant]
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D01. [cited by applicant]
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D02. [cited by applicant]
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D03. [cited by applicant]
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D04. [cited by applicant]
Wafer Carrier Trays, https://www.tedpelia.com/storage-boes-bags_html/wafer-carrier-trays.aspx, 2023. (Year: 2023). [cited by applicant]
Jul. 27, 2023 Search Report from Notice of Allowance issued in Taiwanese Patent Application No. 112302142. [cited by applicant]
Jul. 27, 2023 Search Report from Notice of Allowance issued in Taiwanese Patent Application No. 112302143. [cited by applicant]
Jul. 28, 2023 Office Action issued in Chinese Patent Application No. 202230212056.9. [cited by applicant]
Nov. 6, 2023 Office Action issued in U.S. Appl. No. 29/835,098. [cited by applicant]
Mar. 20, 2024 Office Action issued in U.S. Appl. No. 29/835,098. [cited by applicant]
Jun. 13, 2024 Office Action issued in Chinese Patent Application No. 202330659182.3. [cited by applicant]