IP Library Granted Patent US 11,566,628
Granted Patent B1
US 11,566,628 · App. 17/588,217 · Granted Jan 31, 2023

Handheld fan

Inventor: Lifang Liu (Shenzhen, CN)
F04D25/084F04D19/002F04D29/5853H01L35/28
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Quick Facts
Patent No.
US 11,566,628
App. No.
17/588,217
Granted
Jan 31, 2023
Kind
B1
Abstract

A handheld fan includes a housing, a fan assembly mounted in the housing and close to a rear portion of the housing, a semiconductor chilling plate mounted in the housing and arranged in front of the fan assembly, and a cold conducting piece arranged on a front end of the housing. A front end surface of the semiconductor chilling plate is a cooling surface. The cold conducting piece is attached to the front end surface of the semiconductor chilling plate. An air outlet is defined between the cold conducting piece and the housing.

Claims (18)

1. A handheld fan, comprising:

a housing;

a fan assembly mounted in the housing and close to a rear portion of the housing;

a semiconductor chilling plate mounted in the housing and arranged in front of the fan assembly; and

a cold conducting piece arranged on a front end of the housing;

wherein a front end surface of the semiconductor chilling plate is a cooling surface; the cold conducting piece is attached to the front end surface of the semiconductor chilling plate; an air outlet is defined between the cold conducting piece and the housing;

wherein an air duct is arranged on a front portion in the housing; and

a mounting portion is arranged in a middle portion of the air duct the mounting portion is in a shape of a bowl with a first opening and a second opening separately on two ends of the mounting portion, the first opening is greater than the second opening; the first opening faces forward.

2. The handheld fan according to claim 1 , wherein the cold conducting piece comprises a metal temperature-conducting cover and a metal temperature-conducting block; a rear end surface of the metal temperature-conducting block is attached to the cooling surface of the semiconductor chilling plate; an area of the rear end surface of the metal temperature-conducting block is greater than an area of the front end surface of the semiconductor chilling plate; the metal temperature-conducting cover is covered on a front end surface of the metal temperature-conducting block.

3. The handheld fan according to claim 2 , wherein the front end surface of the metal temperature-conducting cover is an arc surface protruding forward.

4. The handheld fan according to claim 3 , wherein the housing comprises a front shell and a rear shell; the fan assembly, the semiconductor chilling plate, and the cold conducting piece are fixed on the rear shell.

5. The handheld fan according to claim 2 , wherein the housing comprises a front shell and a rear shell; the fan assembly, the semiconductor chilling plate, and the cold conducting piece are fixed on the rear shell.

6. The handheld fan according to claim 1 , wherein the handheld fan further comprises a heat dissipating net, the heat dissipating net is arranged between the semiconductor chilling plate and the fan assembly; the heat dissipating net is attached to a rear end surface of the semiconductor chilling plate.

7. The handheld fan according to claim 6 , wherein the heat dissipating net is arranged behind the air outlet.

8. The handheld fan according to claim 7 , wherein the housing comprises a front shell and a rear shell; the fan assembly, the semiconductor chilling plate, and the cold conducting piece are fixed on the rear shell.

9. The handheld fan according to claim 6 , wherein the housing comprises a front shell and a rear shell; the fan assembly, the semiconductor chilling plate, and the cold conducting piece are fixed on the rear shell.

10. The handheld fan according to claim 1 , wherein a shape of an outer contour of the air duct is matched with a shape of an inner wall of the housing; the mounting portion is hollow; a front portion of the mounting portion is configured to fix the semiconductor chilling plate and the cold conducting piece; a gap is defined between a side wall of the mounting portion and a side wall of the air duct to form the air outlet.

11. The handheld fan according to claim 1 , wherein the housing comprises a front shell and a rear shell; the fan assembly, the semiconductor chilling plate, and the cold conducting piece are fixed on the rear shell.

Cited By (21)
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