OLED panel with advanced sub-pixel overhangs
Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed over and extending laterally past a base structure disposed over the PDL structure. Each second overhang is defined by a top structure disposed over and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed over the HIL material and extends under the first overhang.
1. A device, comprising:
a substrate;
a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, wherein each PDL structure comprises an upper surface; and
a plurality of sub-pixels, each sub-pixel comprising:
adjacent first overhangs, each first overhang defined by a body extension of a body structure extending laterally past a base structure, the base structure disposed over the upper surface of the PDL structure, and the body structure disposed over the base structure;
adjacent second overhangs, each second overhang defined by a top extension of a top structure extending laterally past an overhang portion of body extension, the top structure disposed over the body structure;
an anode;
a hole injection layer (HIL) material disposed over and in contact with the anode and disposed under the adjacent second overhangs;
an additional organic light emitting diode (OLED) material disposed over the HIL material, wherein the additional OLED material extends under the adjacent first overhangs to contact the PDL structure past an endpoint of the HIL material; and
a cathode disposed over the additional OLED material, the cathode extending under the adjacent second overhangs and contacting a second portion of the body extension.
2. The device of claim 1 , wherein the HIL material is disposed over and in contact with the anode and is disposed under the adjacent first and second overhangs such that the HIL contacts the body extension, wherein a portion of the additional OLED material disposed under the adjacent first overhangs separates the HIL material disposed over the anode and the HIL material on the body extension.
3. The device of claim 1 , wherein an encapsulation layer is disposed over the cathode, wherein the encapsulation layer extends:
to contact the cathode over the second portion of the body extension; and
to contact a conductive material of the body structure at a third portion of the body extension.
4. The device of claim 1 , wherein the body structure comprises a conductive material of at least one of a metal or metal alloy.
5. The device of claim 1 , wherein the top structure comprises an inorganic material.
6. The device of claim 1 , wherein the additional OLED material extends to contact the anode past an endpoint of the HIL material.
7. The device of claim 1 , wherein the HIL material extends to contact the anode past an endpoint of the additional OLED material.
8. The device of claim 1 , wherein the base structure comprises a metal containing material.
9. The device of claim 1 , wherein an encapsulation layer is disposed over the cathode, wherein the encapsulation layer extends:
to contact a conductive material of the body structure.
10. The device of claim 1 , wherein the anode is a layer stack of a first transparent conductive oxide (TCO) layer, a second metal layer disposed over the first TCO layer, and a third TCO layer disposed over the second metal layer, wherein the base structure is disposed over the upper surface of the third TCO layer.
11. The device of claim 1 , wherein the additional OLED material is disposed over a first portion of the body extension.
12. A device, comprising:
a substrate;
a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, wherein each PDL structure comprises an upper surface; and
a plurality of sub-pixels, each sub-pixel comprising:
adjacent first overhangs, each first overhang defined by a body extension of a body structure extending laterally past a base structure, the base structure disposed over the upper surface of the PDL structure, and the body structure disposed over the base structure;
adjacent second overhangs, each second overhang defined by a top extension of a top structure extending laterally past an overhang portion of body extension, the top structure disposed over the body structure;
an anode;
a hole injection layer (HIL) material disposed over and in contact with the anode and disposed under the adjacent second overhangs;
an additional organic light emitting diode (OLED) material disposed over the HIL material, wherein the additional OLED material extends under the adjacent first overhangs and wherein the HIL material extends to contact the PDL structure past an endpoint of the additional OLED material; and
a cathode disposed over the additional OLED material, the cathode extending under the adjacent second overhangs and contacting a second portion of the body extension.
13. The device of claim 12 , wherein the body structure comprises one of aluminum (Al), Aluminum neodymium (AlNd), molybdenum (Mo), molybdenum tungsten (MoW), copper (Cu), or combinations thereof.
14. The device of claim 12 , wherein an encapsulation layer is disposed over the cathode, wherein the encapsulation layer extends:
to contact the cathode over the body structure; and
to contact the body structure.
15. A device, comprising:
a substrate;
a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, wherein each PDL structure comprises an upper surface; and
a plurality of sub-pixels, each sub-pixel comprising:
adjacent first overhangs, each first overhang defined by a body extension of a body structure extending laterally past a base structure, the base structure disposed over the upper surface of the PDL structure, and the body structure disposed over the base structure;
adjacent second overhangs, each second overhang defined by a top extension of a top structure extending laterally past an overhang portion of body extension, the top structure disposed over the body structure;
an anode;
a hole injection layer (HIL) material disposed over and in contact with the anode and disposed under the adjacent second overhangs;
an additional organic light emitting diode (OLED) material disposed over the HIL material, wherein:
the additional OLED material extends under the adjacent first overhangs to contact the PDL structure past an endpoint of the HIL material; or
the HIL material extends to contact the PDL structure past an endpoint of the additional OLED material; and
a cathode disposed over the additional OLED material, the cathode extending under the adjacent second overhangs and contacting a second portion of the body extension.
16. The device of claim 15 , wherein the base structure comprises a metal containing material or an inorganic material.
17. The device of claim 8 , wherein the metal containing material is a transparent conductive oxide (TCO) material.
18. The device of claim 15 , wherein the body structure comprises a conductive material of at least one of a metal or a metal alloy.
19. The device of claim 15 , where in the top structure comprises an inorganic material.
20. The device of claim 15 , wherein the additional OLED material is disposed over a first portion of the body extension.
21. The device of claim 16 , wherein the metal containing material is a transparent conductive oxide (TCO) material.
22. The device of claim 15 , wherein the HIL material is disposed over and in contact with the anode and is disposed under the adjacent first and second overhangs such that the HIL contacts the body extension, wherein a portion of the additional OLED material disposed under the adjacent first overhangs separates the HIL material disposed over the anode and the HIL material on the body extension.
23. The device of claim 15 , wherein an encapsulation layer is disposed over the cathode, wherein the encapsulation layer extends:
to contact the cathode over the second portion of the body extension; and
to contact a conductive material of the body structure at a third portion of the body extension.
24. The device of claim 15 , wherein the additional OLED material extends to contact the anode past an endpoint of the HIL material.
25. The device of claim 15 , wherein the HIL material extends to contact the anode past an endpoint of the additional OLED material.
26. The device of claim 25 , wherein the anode is a layer stack of a first transparent conductive oxide (TCO) layer, a second metal layer disposed over the first TCO layer, and a third TCO layer disposed over the second metal layer, wherein the base structure is disposed over the upper surface of the third TCO layer.
27. The device of claim 15 , wherein an encapsulation layer is disposed over the cathode, wherein the encapsulation layer extends:
to contact a conductive material of the body structure.