IP Library Granted Patent US 12,376,413
Granted Patent B2
US 12,376,413 · App. 18/669,153 · Granted Jul 29, 2025

Light-emitting module and display apparatus

Inventors: Min-Hsun Hsieh (Hsinchu, TW); Jen-Chieh Yu (Hsinchu, TW); Chun-Wei Chen (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H10F55/15G09G3/32H05B45/12G09G2320/0626
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Quick Facts
Patent No.
US 12,376,413
App. No.
18/669,153
Granted
Jul 29, 2025
Kind
B2
Abstract

The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. The light-emitting groups matrix comprises m columns and n rows.

Claims (26)

1. A light-emitting apparatus, comprising:

a carrier;

a first light-emitting module located on the carrier, comprising:

a first circuit substrate, comprising a first surface, a second surface opposite to the first surface, a plurality of first conductive channels arranged on the first surface, and a plurality of first conductive pads arranged on the second surface;

a first light-emitting group arranged on the first surface, and comprising a first red light-emitting diode chip, a first green light-emitting diode chip, and a first blue light-emitting diode chip;

a first electric component disposed on the first surface; and

a first translucent encapsulating component covering the first light-emitting group and the first electric component; and

a second light-emitting module located on the carrier, comprising:

a second circuit substrate, comprising a third surface, a fourth surface opposite to the third surface, a plurality of second conductive channels arranged on the third surface, and a plurality of second conductive pads arranged on the fourth surface;

a second light-emitting group arranged on the third surface, and comprising a second red light-emitting diode chip, a second green light-emitting diode chip, and a second blue light-emitting diode chip;

a second electric component disposed on the third surface; and

a second translucent encapsulating component covering the second light-emitting group and the second electric component;

wherein the first electric component is an infrared light-emitting diode, and the second electric component is an infrared photodiode.

2. The light-emitting apparatus according to claim 1 , wherein the first light-emitting module further comprises a plurality of first light-emitting groups which comprises the first light-emitting group and is arranged on the first surface to collectively form a first light-emitting groups matrix, and the first light-emitting groups matrix is arranged in m columns and n rows.

3. The light-emitting apparatus according to claim 2 , wherein the plurality of first conductive pads comprises 11 conductive pads, and one of the 11 conductive pads is not electrically connected to any of the light-emitting diode chips.

4. The light-emitting apparatus according to claim 2 , wherein the first red light-emitting diode chip, the first green light-emitting diode chip, and the first blue light-emitting diode chip each comprises an anode contact electrode, and the anode contact electrode of the first red light-emitting diode chip, the first green light-emitting diode chip, and the first blue light-emitting diode chip are electrically connected to one of the plurality of first conductive pads.

5. The light-emitting apparatus according to claim 1 , wherein one of the plurality of first conductive pads is electrically connected to the first electric component.

6. The light-emitting apparatus according to claim 1 , wherein the first translucent encapsulating component comprises carbon black particles.

7. The light-emitting apparatus according to claim 6 , wherein the carbon black particles are greater than or equal to 0.005 wt % and less than 1 wt % in the first translucent encapsulating component.

8. The light-emitting apparatus according to claim 1 , wherein the first translucent encapsulating component comprises inorganic particle fillers.

9. The light-emitting apparatus according to claim 1 , wherein the first electric component is substantially disposed on a center of the first light-emitting module in a top view.

10. The light-emitting apparatus according to claim 1 , further comprising a light-shielding structure located on and directly contacting the first surface.

11. The light-emitting apparatus according to claim 10 , wherein the light-shielding structure comprises an uneven top surface.

12. The light-emitting apparatus according to claim 1 , further comprising an electronic signal receiving unit for receiving electronic signals emitted by the first light-emitting module and the second light-emitting module.

13. The light-emitting apparatus according to claim 12 , further comprising a comparison unit to compare whether the first light-emitting module reaches an appropriate brightness range.

14. The light-emitting apparatus according to claim 1 , further comprising a feedback controlling unit electrically connected to the first light-emitting module for controlling a brightness of the first light-emitting module.

Assignments (2)
CHANGE OF NAME Recorded Feb 18, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075171/0402 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2024
From: HSIEH, MIN-HSUN; YU, JEH-CHIEH; CHEN, CHUN-WEI
To: EPISTAR CORPORATION
Reel/Frame 067472/0633 →