IP Library › Granted Patent US 4,091,529
Granted Patent Utility
US 4,091,529 · App. 05/771,132

Method of forming substrate terminal areas for bonded leads

Inventor: Vincent Joseph Zaleckas
Patented Case View Patent ↗
Granted: May 30, 1978 Filed: Feb 23, 1977
Inventor
Vincent Joseph Zaleckas
Assignee (at issue)
Western Electric Company, Inc.

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Quick Facts
Patent No.
US 4,091,529
App. No.
05/771,132
Filed
1977-02-23
Granted
1978-05-30
Kind
A