IP Library › Granted Patent US 4,132,856
Granted Patent Utility
US 4,132,856 · App. 05/855,286

Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby

Inventors: Robert V. Hutchison, John A. Nelson
Patented Case View Patent ↗
Granted: Jan 2, 1979 Filed: Nov 28, 1977
Inventors
Robert V. Hutchison
John A. Nelson
Assignee (at issue)
Burroughs, Inc.

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Quick Facts
Patent No.
US 4,132,856
App. No.
05/855,286
Filed
1977-11-28
Granted
1979-01-02
Kind
A