IP Library › Granted Patent US 4,137,546
Granted Patent Utility
US 4,137,546 · App. 05/842,322

Stamped lead frame for semiconductor packages

Inventor: John M. Frusco
Patented Case View Patent ↗
Granted: Jan 30, 1979 Filed: Oct 14, 1977
Inventor
John M. Frusco
Assignee (at issue)
The Plessey Company Limited

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Quick Facts
Patent No.
US 4,137,546
App. No.
05/842,322
Filed
1977-10-14
Granted
1979-01-30
Kind
A