Granted Patent
Utility
US 4,188,085 · App. 05/946,279
High density solder tail connector assembly for leadless integrated circuit packages
Inventors:
Lionel D. Aldridge, George J. Sprenkle
Patented Case
View Patent ↗
Granted: Feb 12, 1980
Filed: Sep 27, 1978
Inventors
Lionel D. Aldridge
George J. Sprenkle
Assignee (at issue)
Burroughs, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.