Granted Patent
Utility
US 4,208,698 · App. 05/845,567
Novel hybrid packaging scheme for high density component circuits
Inventor:
Tanjore R. Narasimhan
Patented Case
View Patent ↗
Granted: Jun 17, 1980
Filed: Oct 26, 1977
Inventor
Tanjore R. Narasimhan
Assignee (at issue)
ILC Data Device Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.