Granted Patent
Utility
US 4,243,472 · App. 06/016,883
Method for liquid phase epitaxy multiple dipping of wafers for bubble film growth
Inventor:
Charles F. O'Neill
Patented Case
View Patent ↗
Granted: Jan 6, 1981
Filed: Mar 2, 1979
Inventor
Charles F. O'Neill
Assignee (at issue)
Burroughs, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.