IP Library › Granted Patent US 4,253,111
Granted Patent Utility
US 4,253,111 · App. 05/945,710

Apparatus for bonding leads to semiconductor chips

Inventors: Ernest J. Funk, Russell Union, Margaret M. Pratt
Patented Case View Patent ↗
Granted: Feb 24, 1981 Filed: Sep 25, 1978
Inventors
Ernest J. Funk
Russell Union
Margaret M. Pratt
Assignee (at issue)
GCA Corporation

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Quick Facts
Patent No.
US 4,253,111
App. No.
05/945,710
Filed
1978-09-25
Granted
1981-02-24
Kind
A